Design Engineer

Amkor Technology, Inc.; Phoenix (AZ); Hybrid; USD 90,000 - 130,000; Full time

Job summary

Amkor Technology, Inc. seeks an IC Package Design Engineer for its Tempe, Arizona location. You will design laminate (BGA) and wafer-level packages, create precise drawings, and troubleshoot design challenges for thermal, mechanical, and electrical requirements.

This role emphasizes collaboration with cross-functional teams and customers to deliver robust package solutions. You will work with CAD tools to produce detailed engineering drawings, support design reviews, and contribute to process

Qualifications

• Bachelor's degree in Electrical or Mechanical Engineering.
• Experience using CAD or similar engineering software to create and maintain drawings.
• Strong verbal and written communication skills.
• Ability to manage multiple tasks and complete assignments with minimal supervision.
• Self-motivated, detail-oriented, and collaborative in a fast-paced team.

Responsibilities

• Design laminate (BGA) and wafer-level packages based on thermal, mechanical, and electrical requirements.
• Create accurate engineering drawings with minimal supervision.
• Analyze and resolve design challenges and customer-related technical issues.
• Identify opportunities to improve design methodologies, processes, and technologies.
• Collaborate with Product Group and Sales teams to ensure customer requirements are understood and achieved.
• Prepare technical documentation and maintain accurate engineering records.

Skills

CAD software

Multitasking

Team collaboration

Technical communication

Education

Bachelor's degree in Electrical or Mechanical Engineering

Tools

Cadence APD

Cadence Sigrity

Siemens Expedition

Ansys HFSS

CAM350

Job description

Amkor Technology is seeking an IC Package Design Engineer for its Tempe, Arizona location. This role is responsible for developing high-quality IC package designs, creating detailed engineering drawings, and supporting multiple design-related activities within the Design Center. The engineer collaborates with internal teams and customers to deliver package solutions that meet thermal, mechanical, electrical, and manufacturing requirements.

Essential Duties and Responsibilities:

• Design laminate (BGA) and wafer-level semiconductor packages, including determination of design rules, optimization, verification, and package selection based on thermal, mechanical, and electrical requirements.
• Create accurate and detailed engineering drawings with minimal supervision.
• Analyze and resolve design challenges and customer-related technical issues using sound engineering principles.
• Identify opportunities to improve design methodologies, processes, and technologies.
• Exercise sound judgment when making design-related decisions and recommendations.
• Build and maintain effective partnerships with customers and cross-functional teams to support quality and productivity objectives.
• Collaborate with Amkor Product Group and Sales teams to ensure customer requirements are understood and achieved.
• Interface with internal and external customers to support design reviews, technical discussions, and project execution.
• Prepare technical documentation and maintain accurate engineering records.
• Demonstrate a continuous learning mindset and contribute positively to team development and knowledge sharing.
• Perform other duties as assigned.

Required Qualifications:

• Bachelor's degree in Electrical Engineering, Mechanical Engineering, or a related engineering discipline.
• Experience using CAD or similar engineering software to create and maintain technical drawings.
• Strong verbal and written communication skills.
• Ability to manage multiple tasks and complete assignments effectively with minimal supervision.
• Self-motivated, detail-oriented, and able to work collaboratively in a team environment.
• Demonstrated ability to meet project deadlines and manage priorities in a fast-paced setting.

Preferred Qualifications:

• Experience using package design and simulation tools such as Cadence APD, Cadence Sigrity, Siemens Expedition, Ansys HFSS, and CAM350.
• Working knowledge of Geometric Dimensioning and Tolerancing (GD&T) practices.
• Signal Integrity (SI) and Power Integrity (PI) analysis experience.

Location:

Tempe, AZ. This position has a hybrid schedule. Candidates must reside near the local Amkor office or be willing to relocate to be considered.

Please note: This position may require access to export-controlled information. Candidate must be a U.S. Person (U.S. citizen, lawful permanent resident, or protected individual) or be eligible to qualify for a U.S. Government export authorization.

Amkor is proud to be an Equal Opportunity Employer. We do not discriminate on the basis of race, color, ancestry, national origin, religion or religious creed, mental or physical disability, medical condition, genetic information, sex (including pregnancy, childbirth, and related medical conditions), sexual orientation, gender identity, gender expression, age, marital status, military or veteran status, citizenship, or other characteristics protected by state or federal law or local ordinance.