A complete application in a minute
Tailored resume and cover letter, ready to send.
Amkor Technology, Inc. seeks an IC Package Design Engineer for its Tempe, Arizona location. You will design laminate (BGA) and wafer-level packages, create precise drawings, and troubleshoot design challenges for thermal, mechanical, and electrical requirements.
This role emphasizes collaboration with cross-functional teams and customers to deliver robust package solutions. You will work with CAD tools to produce detailed engineering drawings, support design reviews, and contribute to process
Amkor Technology, Inc. seeks an IC Package Design Engineer for its Tempe, Arizona location. You will design laminate (BGA) and wafer-level packages, create precise drawings, and troubleshoot design challenges for thermal, mechanical, and electrical requirements.
This role emphasizes collaboration with cross-functional teams and customers to deliver robust package solutions. You will work with CAD tools to produce detailed engineering drawings, support design reviews, and contribute to process