High-Speed Signal Integrity Test Engineer

ImageTek Mfg., Inc.; Putnam (CT); On-site; USD 80,000 - 120,000; Full time

Job summary

ImageTek Mfg., Inc. in Putnam, CT is seeking a Signal Integrity Test Engineer to evaluate high-speed copper cable systems.

You will work with design, simulation, and manufacturing teams to validate signal performance and drive product quality through data-driven analysis. Responsibilities include SI measurements with VNA/TDR, debugging DUTs with manufacturing engineers, developing DOE plans, and correlating results with simulations.

Qualifications

• Bachelor's degree in Electrical Engineering or related field.
• Minimum 2+ years in signal integrity or high-speed hardware testing.
• Strong analytical and problem-solving skills.

Responsibilities

• Perform SI measurements to evaluate copper cable performance using lab equipment.
• Debug and perform root cause analysis on DUT with manufacturing engineers.
• Develop and execute DOE plans to identify issues and drive resolution.
• Correlate measurement results with simulations with design/SI teams.
• Develop/test fixtures and de-embedding methods in collaboration with designers.
• Stay current with IEEE 802.3 and PCIe standards for test methods.
• Develop and maintain automated test scripts for equipment control and data processing.
• Support cable validation procedures, including flex/bending tests.

Skills

Signal integrity fundamentals

DOE

Python for data analysis

Cross-functional collaboration

Data-driven debugging

Education

Bachelor's degree in Electrical Engineering / EM / RF or related field

Tools

Vector Network Analyzer

Time Domain Reflectometer

De-embedding techniques

IEEE 802.3 / PCIe knowledge

Job description

ImageTek Mfg., Inc. in Putnam, CT is seeking a Signal Integrity Test Engineer to evaluate high-speed copper cable systems.

You will work with design, simulation, and manufacturing teams to validate signal performance and drive product quality through data-driven analysis. Responsibilities include SI measurements with VNA/TDR, debugging DUTs with manufacturing engineers, developing DOE plans, and correlating results with simulations.