Signal Integrity Engineer – High-Speed Interconnects

Amphenol Corporation

Santa Clara (CA)

On-site

USD 95,000 - 150,000

Full time

6 days ago
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Benefits offered by this job

Health/dental/vision benefits from day
401(k) matching
Paid holidays & leave

Job summary

Amphenol Corporation is seeking a Signal Integrity Engineer to join the High Speed Products Group in Santa Clara, CA. You will work with a team of SI engineers and other disciplines to develop, simulate, and apply high-speed connectors and cable interconnects for telecom, data center, and automotive applications.

The role emphasizes solving SI challenges across PCB layouts, performing measurements with TDR and VNA, and supporting customers from design to product qualification.

Qualifications

  • BS in Electrical Engineering or Physics required.
  • Experience with frequency-domain and time-domain characterization including test methods.
  • Experience with signal integrity measurements using TDR, VNA, pattern generators and error detectors.
  • Understanding of electromagnetic principles.

Responsibilities

  • Assist with solving customers' high-speed data transmission SI challenges.
  • Identify and resolve SI issues in PCB layouts and guide layouts for customers.
  • Design, simulation, characterization, and application of high-speed connectors and interconnects.
  • Support Sales Engineers to strategize product break-in at accounts using SI expertise.
  • Apply circuit theory and high-speed transmission concepts to PCB layout.
  • Collaborate on multi-disciplinary teams to develop next-gen high-speed backplane interconnects.

Skills

Signal integrity
Electromagnetic theory

Education

BS in Electrical Engineering or Physics

Tools

Ansys HFSS
Ansys Designer
CST Microwave
HSPICE
MatLab
ADS

Job description

Amphenol Corporation is seeking a Signal Integrity Engineer to join the High Speed Products Group in Santa Clara, CA. You will work with a team of SI engineers and other disciplines to develop, simulate, and apply high-speed connectors and cable interconnects for telecom, data center, and automotive applications.

The role emphasizes solving SI challenges across PCB layouts, performing measurements with TDR and VNA, and supporting customers from design to product qualification.

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