HBM Yield Enhancement & Failure Analysis Engineer

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 110,000 - 160,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid time off

Paid holidays

Income protection and paid family rest

Job summary

Micron Technology, Inc. in Boise, Idaho seeks a Level 2 or 3 HBM PDFA Engineer to advance next‑generation HBM devices from design to mass production.

You will perform electrical, physical, and statistical failure analysis to identify root causes and drive corrective actions across the product development failure analysis team. The role emphasizes collaboration with Product, Process, Test, Quality, and Manufacturing teams, with opportunities to apply AI-enabled analytics to improve yield,

Qualifications

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, Materials Science or related field.
• 2+ years of experience performing electrical and statistical failure analysis to identify and understand failure mechanisms.
• 2+ years of experience applying electrical and physical characterization techniques for semiconductor failure analysis.
• Experience using AI, machine learning, or data analytics tools to support engineering analysis and root cause investigations.
• Coursework, training, or practical experience in VLSI design, semiconductor processes, device physics, Python, and statistics.
• Strong written and verbal communication skills with the ability to collaborate effectively in multifunctional engineering teams.

Responsibilities

• Perform electrical, physical, and statistical failure analysis to identify, characterize, and understand defect and failure mechanisms in HBM products.
• Analyze component- and system-level data to resolve root causes of failures using statistical techniques, engineering methodologies, and AI-enabled tools.
• Apply AI tools (e.g., Copilot, Claude) and improved analytics to enhance failure detection, reliability learning cycles, yield improvement, and component performance.
• Work closely with Product, Process, Test, Quality, and Manufacturing Engineering teams to resolve fabrication, assembly, and test-related issues.
• Identify process defects, assembly-related failures, and test flow marginalities through detailed data analysis and characterization.
• Communicate technical findings, recommendations, and corrective actions to team members and drive issue resolution across multifunctional teams.
• Support rapid production ramp, product qualification, and continuous reliability improvement initiatives.

Skills

Electrical failure analysis

Statistical analysis

AI / data analytics tools

Python

VLSI / semiconductor physics

Communication skills

Education

Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, Materials Science

Tools

Python

JMP

Job description

Micron Technology, Inc. in Boise, Idaho seeks a Level 2 or 3 HBM PDFA Engineer to advance next‑generation HBM devices from design to mass production.

You will perform electrical, physical, and statistical failure analysis to identify root causes and drive corrective actions across the product development failure analysis team. The role emphasizes collaboration with Product, Process, Test, Quality, and Manufacturing teams, with opportunities to apply AI-enabled analytics to improve yield,