HBM Product Yield & Failure Analysis Engineer (AI-Driven)

Socket.dev; Boise (ID); On-site; USD 110,000 - 150,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Generous PTO & holidays

Job summary

Micron Technology in Boise, Idaho seeks a Level 2/3 HBM PDFA Engineer to drive failure analysis from design through mass production. You will apply electrical, physical, and statistical techniques to identify root causes and guide corrective actions across multi-functional teams.

Join a team focused on reliability, AI-enabled analytics, and rapid production ramp for next-generation HBM devices, collaborating with Product, Process, Test, Quality, and Manufacturing engineers.

Qualifications

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or related field.
• 2+ years in electrical and statistical failure analysis.
• 2+ years applying electrical/physical characterization techniques for semiconductor failure analysis.
• Strong analytical and problem-solving skills with statistics.
• Experience with AI, ML, or data analytics tools.
• Coursework in VLSI, semiconductor device physics, Python, and statistics.
• Strong written and verbal communication in cross-functional teams.

Responsibilities

• Perform electrical, physical, and statistical failure analysis to identify defect mechanisms in HBM products.
• Analyze component- and system-level data to resolve root causes using statistics and AI-enabled tools.
• Apply AI tools to enhance failure detection, reliability learning cycles, yield improvement, and component performance.
• Work with Product, Process, Test, Quality, and Manufacturing teams to resolve fabrication, assembly, and test issues.
• Identify process defects and test-flow marginalities through data analysis and characterization.
• Communicate technical findings and corrective actions to multi-functional teams for issue resolution.
• Support rapid production ramp, product qualification, and continuous reliability improvement.

Skills

Electrical engineering

Statistical analysis

AI/ML tools

Python programming

Data analytics

Communication skills

Education

Bachelor's degree in Electrical Engineering or related field

Tools

JMP

Copilot/Claude AI tools

Job description

Micron Technology in Boise, Idaho seeks a Level 2/3 HBM PDFA Engineer to drive failure analysis from design through mass production. You will apply electrical, physical, and statistical techniques to identify root causes and guide corrective actions across multi-functional teams.

Join a team focused on reliability, AI-enabled analytics, and rapid production ramp for next-generation HBM devices, collaborating with Product, Process, Test, Quality, and Manufacturing engineers.