HBM Yield & Failure Analysis Engineer – AI-Driven

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 85,000 - 110,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Robust paid time-off program

Job summary

1000 Micron Technology, Inc. is seeking an HBM Product Yield Enhancement PDFA Engineer to join their Product Development Failure Analysis team in Boise, Idaho. This role involves performing electrical and statistical failure analysis to enhance production processes for next-generation HBM devices.

The ideal candidate will have over 3 years of relevant experience and a Bachelor’s degree in Electrical or Computer Engineering. Benefits include comprehensive medical plans and a robust paid time-off program.

Qualifications

• 3+ years of experience using electrical and statistical failure analysis to understand failure mechanisms.
• Proven analytical abilities with proficiency in applying statistical tools.
• 5+ years of experience in electrical characterization techniques preferred.

Responsibilities

• Perform electrical and statistical failure analysis to understand failure mechanisms.
• Identify causes of component failures through data analysis.
• Work closely with partner engineering teams to resolve defect issues.

Skills

Electrical failure analysis

Statistical analysis

Data analysis

Education

Bachelor’s degree in Electrical or Computer Engineering, Physics, or Materials Science

Tools

AI tools

Statistical tools

Job description

1000 Micron Technology, Inc. is seeking an HBM Product Yield Enhancement PDFA Engineer to join their Product Development Failure Analysis team in Boise, Idaho. This role involves performing electrical and statistical failure analysis to enhance production processes for next-generation HBM devices.

The ideal candidate will have over 3 years of relevant experience and a Bachelor’s degree in Electrical or Computer Engineering. Benefits include comprehensive medical plans and a robust paid time-off program.