HBM Product & Systems Intern - AI & HPC Labs

Micron Technology, Inc.; Boise (ID); On-site; USD 34,000 - 55,000; Full time

Benefits offered by this job

Medical, Dental and Vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. in Boise, Idaho invites an HBM Product & System Engineering Intern to help validate and optimize HBM devices, working with senior engineers on testing and integration for AI and HPC platforms.

You will gain hands-on experience with Python, C/C++, RTL modeling, Verilog/SystemVerilog, and FPGA lab work in a collaborative environment while developing practical problem-solving and communication skills.

Qualifications

• Enrolled in a Bachelor’s or Master’s program in Electrical or Computer Engineering.
• Graduation date after September 2027.
• Strong understanding of computer architecture, memory systems, and memory technologies.
• Proficiency in Python, C/C++, and scripting for debugging and testing.
• Excellent problem-solving and analytical skills.
• Enthusiastic teammate with strong communication skills.

Responsibilities

• Develop and improve software and hardware to validate HBM in various systems.
• Configure, maintain, and characterize HBM-based systems in a lab environment.
• Assist in debugging complex technical challenges across hardware and software.
• Communicate results and insights to teammates and leadership.
• Learn and apply knowledge of HBM, DRAM, and memory systems.

Education

Bachelor's or Master’s in Electrical or Computer Engineering

Tools

Python

C/C++

RTL Modeling

Verilog/SystemVerilog

FPGAs

Job description

Micron Technology, Inc. in Boise, Idaho invites an HBM Product & System Engineering Intern to help validate and optimize HBM devices, working with senior engineers on testing and integration for AI and HPC platforms.

You will gain hands-on experience with Python, C/C++, RTL modeling, Verilog/SystemVerilog, and FPGA lab work in a collaborative environment while developing practical problem-solving and communication skills.