HBM Systems Engineer Intern — AI & HPC Lab

Micron Technology, Inc.; Boise (ID); On-site; USD 34,000 - 48,000; Part time

Job summary

Micron Technology, Inc. is seeking an HBM Product & System Engineering Intern in Boise to support validation and optimization of HBM products. You will work with experienced engineers to test, integrate, and improve hardware and software for demanding platforms.

This internship emphasizes hands-on lab work, exposure to memory interfaces (LPDDR, DDR, HBM, PCIe), RTL/Verilog, and scripting in Python/C++. Collaboration and clear communication are key as you contribute to advancing high-performance

Qualifications

• Enrolled in a Bachelor's or Master's in Electrical or Computer Engineering, graduation after Sep 2027.
• Strong understanding of computer architecture and memory systems.
• Proficiency in Python, C/C++, and scripting for debugging and testing.
• Excellent problem-solving, analytical skills, and proactive teamwork.

Responsibilities

• Develop and validate hardware and software for HBM in systems.
• Configure, maintain, and characterize HBM-based lab systems.
• Debug complex hardware-software integration challenges.
• Communicate results to teammates and leadership.
• Learn memory interfaces and protocols including LPDDR, DDR, HBM, PCIe.

Skills

Python

C/C++

Scripting

Problem-solving

Communication

Education

Bachelor's or Master in Electrical or Computer Engineering

Tools

Verilog/SystemVerilog

Linux

FPGAs

Job description

Micron Technology, Inc. is seeking an HBM Product & System Engineering Intern in Boise to support validation and optimization of HBM products. You will work with experienced engineers to test, integrate, and improve hardware and software for demanding platforms.

This internship emphasizes hands-on lab work, exposure to memory interfaces (LPDDR, DDR, HBM, PCIe), RTL/Verilog, and scripting in Python/C++. Collaboration and clear communication are key as you contribute to advancing high-performance