HBM SoC Architect & RTL Design Engineer

Micron Technology, Inc.

Folsom (CA)

On-site

USD 165,000 - 329,000

Full time

14 days+
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Job summary

Micron Technology, Inc. seeks a Custom HBM Architecture and Design Engineer to lead RTL and memory subsystem design for HBM logic die within the Heterogeneous Integration Group.

You will collaborate with architecture, design, verification, and product teams to deliver high‑performance, power‑aware SoC solutions for AI/ML workloads. You will also drive next‑gen HBM architecture, integrate IP, perform pre‑ and post‑silicon validation, and contribute to design reviews, focusing on manufacturability

Qualifications

  • Bachelor’s or master’s degree in electrical engineering, computer engineering, or a related field; minimum 10 years of experience.
  • Proficiency in SystemVerilog/Verilog and familiarity with SoC integration methodologies.
  • Experience with the RTL-to-GDS flow, including synthesis, static timing analysis, and sign-off considerations.
  • Familiarity with EDA tools from Cadence, Synopsys, and/or Siemens.
  • Programming or scripting experience (e.g., Python, TCL, Perl, or shell scripting).

Responsibilities

  • Analyze hardware and software interaction at the system level to identify bottlenecks in AI/ML workloads and HBM-based hardware.
  • Drive future HBM architecture, design, and technology to address bottlenecks, including proof-of-concept designs.
  • Architect, design and implement RTL for SoC-level blocks and subsystems used in HBM logic die.
  • Architect and design memory sub-systems including memory IP selection and integration, bus and protocol selection, and power/performance/area optimization.
  • Integrate internal and third-party IP (controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY-adjacent logic).
  • Translate architectural and micro-architectural specs into RTL implementations.
  • Participate in SoC-level integration activities (clocking, reset, power intent, configuration).
  • Assist with pre-silicon validation and post-silicon bring-up; root-cause analysis of silicon issues.
  • Contribute to design documentation, block specs, and reviews.
  • Collaborate cross-functionally with Product Eng, Test, Process, and Manufacturing for robust builds.

Skills

SystemVerilog/Verilog
RTL-to-GDS flow
EDA tools Cadence/Synopsys/Siemens
Programming/scripting

Education

Bachelor’s or Master’s in EE/CE

Tools

Palladium
Veloce
Zebu

Job description

Micron Technology, Inc. seeks a Custom HBM Architecture and Design Engineer to lead RTL and memory subsystem design for HBM logic die within the Heterogeneous Integration Group.

You will collaborate with architecture, design, verification, and product teams to deliver high‑performance, power‑aware SoC solutions for AI/ML workloads. You will also drive next‑gen HBM architecture, integrate IP, perform pre‑ and post‑silicon validation, and contribute to design reviews, focusing on manufacturability

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