HBM Product Reliability & Failure Analysis Engineer

Micron

Boise (ID)

On-site

USD 110,000 - 160,000

Full time

6 days ago
Be an early applicant

A complete application in a minute

Tailored resume and cover letter, ready to send.

Get past ATS filters

Job summary

Micron Technology in Boise, Idaho seeks an HBM Product Yield Enhancement PDFA Engineer to drive reliability through failure analysis, characterization, and data-driven problem solving. You will use electrical, physical, and AI-assisted techniques to identify failure mechanisms during new HBM product introductions.

You will collaborate with Product, Process, Quality, and Test Engineering teams to resolve yield and reliability issues, and to support rapid production ramp.

Qualifications

  • Bachelor's degree in a related technical field.
  • Experience with semiconductor physics, devices, or VLSI.
  • Experience using Python or similar for data analysis.
  • Ability to communicate findings in a collaborative engineering environment.

Responsibilities

  • Perform electrical, physical, and statistical failure analysis to identify failure mechanisms.
  • Analyze characterization and manufacturing data to determine root causes of failures.
  • Collaborate with Product, Process, Quality, and Test Engineering teams to resolve issues.
  • Leverage AI-enabled tools and statistical methods to evaluate large datasets and identify trends.
  • Communicate findings and corrective actions to support product qualification and ramp.

Skills

Statistical analysis
Python for data analysis
Data-driven problem solving
Technical communication

Education

Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or related field
Master's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or related field

Tools

Statistical software
Python

Job description

Micron Technology in Boise, Idaho seeks an HBM Product Yield Enhancement PDFA Engineer to drive reliability through failure analysis, characterization, and data-driven problem solving. You will use electrical, physical, and AI-assisted techniques to identify failure mechanisms during new HBM product introductions.

You will collaborate with Product, Process, Quality, and Test Engineering teams to resolve yield and reliability issues, and to support rapid production ramp.

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

HBM Product Failure & Yield Engineer
HBM Product Failure & Yield Engineer

Micron Technology, Inc. • Boise (ID)

On-site
USD 120,000 - 180,000
Medical benefits
Paid time off
Holidays
HBM PDFA Engineer: AI-Driven Yield & Failure Analysis
HBM PDFA Engineer: AI-Driven Yield & Failure Analysis

Micron • Boise (ID)

On-site
USD 110,000 - 170,000
HBM Product Failure Analysis & Yield Engineer
HBM Product Failure Analysis & Yield Engineer

Micron Technology, Inc. • Boise (ID)

On-site
USD 110,000 - 140,000
Medical plans
Dental plans
Vision plans
+3
HBM Product Failure Analysis Engineer - New Grad
HBM Product Failure Analysis Engineer - New Grad

Micron Technology, Inc. • Boise (ID)

On-site
USD 85,000 - 120,000
Medical insurance
Dental insurance
Vision plans
+2
Staff HBM PYE Product Development Failure Analysis Engineer
Staff HBM PYE Product Development Failure Analysis Engineer

Micron Technology, Inc. • Boise (ID)

On-site
USD 110,000 - 170,000
New Grad Yield Enhancement Engineer
New Grad Yield Enhancement Engineer

Micron Technology, Inc • Boise (ID)

On-site
USD 70,000 - 110,000
Medical, dental, and vision plans
Paid time off
Paid holidays
New College Grad - HBM PYE Product Development Failure Analysis Engineer
New College Grad - HBM PYE Product Development Failure Analysis Engineer

Micron Technology, Inc. • Boise (ID)

On-site
USD 85,000 - 120,000
Medical insurance
Dental insurance
Vision plans
+2
New College Grad - HBM PYE Product Development Failure Analysis Enginee
New College Grad - HBM PYE Product Development Failure Analysis Enginee

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 110,000 - 140,000
Medical plans
Dental plans
Vision plans
+3
New College Grad - HBM PYE Product Development Failure Analysis Enginee
New College Grad - HBM PYE Product Development Failure Analysis Enginee

Micron • Boise (ID)

On-site
USD 110,000 - 160,000
Yield Optimization Engineer
Yield Optimization Engineer

Micron Technology, Inc. • Boise (ID)

On-site
USD 90,000 - 130,000
Medical, dental, vision plans
Paid time off & holidays
Paid family leave