HBM Product Failure Analysis Engineer - New Grad

Micron Technology, Inc.; Boise (ID); On-site; USD 85,000 - 120,000; Full time

Benefits offered by this job

Medical insurance

Dental insurance

Vision plans

Paid time off

Paid holidays

Job summary

Micron Technology, Inc. is seeking a New College Grad HBM PYE Product Development Failure Analysis Engineer to join the PDFA team.

You will focus on reliability and component-level failure analysis during new HBM introductions, using electrical, physical, and AI-driven data methods to uncover failure mechanisms and enable rapid production ramp. You will collaborate with Product, Process, Quality, and Test Engineering to translate complex data into actionable engineering solutions, supporting

Qualifications

• Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related technical field.
• Experience in semiconductor device physics, semiconductor manufacturing processes, or VLSI design.
• Demonstrated knowledge of statistical analysis techniques and data-driven problem solving.
• Experience using Python or similar programming languages for data analysis and engineering applications.

Responsibilities

• Perform electrical, physical, and statistical failure analysis to identify and understand component failure mechanisms.
• Analyze characterization and manufacturing data to determine root causes of fabrication, assembly, and test-related failures.
• Collaborate with Product, Process, Quality, and Test Engineering teams to resolve yield, reliability, and process defect issues.
• Leverage AI-enabled tools and statistical methods to evaluate large datasets, identify trends, and improve component performance.
• Communicate findings, corrective actions, and risk assessments to multi-functional partners to support successful product qualification and production ramp.

Skills

Python

Statistical analysis

Data analysis

Engineering collaboration

Education

Bachelor's degree in Electrical Engineering

Tools

Statistical software

Job description

Micron Technology, Inc. is seeking a New College Grad HBM PYE Product Development Failure Analysis Engineer to join the PDFA team.

You will focus on reliability and component-level failure analysis during new HBM introductions, using electrical, physical, and AI-driven data methods to uncover failure mechanisms and enable rapid production ramp. You will collaborate with Product, Process, Quality, and Test Engineering to translate complex data into actionable engineering solutions, supporting