HBM Product Failure Analysis & Yield Engineer

Micron Technology, Inc.; Boise (ID); On-site; USD 110,000 - 140,000; Full time

Benefits offered by this job

Medical plans

Dental plans

Vision plans

Paid time off

Paid holidays

Income protection / disability

Job summary

Micron Technology, Inc. is seeking an HBM Product Yield Enhancement PDFA Engineer to drive reliability analysis for next‑gen High Bandwidth Memory products.

You will perform electrical, physical, and statistical failure analysis and work with product, process, quality, and test teams to resolve yield and reliability issues. Responsibilities include data-driven root cause analysis, AI-enabled data evaluation, and effective communication of findings to multi-functional partners to support

Qualifications

• Bachelor's degree in Electrical/Computer Engineering, Physics, Materials Science or related field (or equivalent experience).
• Experience or coursework in semiconductor device physics, manufacturing processes, or VLSI design.
• Statistical analysis techniques and data-driven problem solving experience.
• Python or similar language for data analysis.

Responsibilities

• Perform electrical, physical, and statistical failure analysis to identify failure mechanisms.
• Analyze characterization and manufacturing data to determine root causes of failures.
• Collaborate with cross-functional teams to resolve yield and reliability issues.
• Leverage AI-driven tools to evaluate large datasets and identify trends.
• Communicate findings and corrective actions to support production ramp and qualification.

Skills

Analytical thinking

Data analysis

Communication

Team collaboration

Education

Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or related field

Master's degree preferred

Tools

Python

AI-enabled data analysis tools

Job description

Micron Technology, Inc. is seeking an HBM Product Yield Enhancement PDFA Engineer to drive reliability analysis for next‑gen High Bandwidth Memory products.

You will perform electrical, physical, and statistical failure analysis and work with product, process, quality, and test teams to resolve yield and reliability issues. Responsibilities include data-driven root cause analysis, AI-enabled data evaluation, and effective communication of findings to multi-functional partners to support