HBM Product Failure & Yield Engineer

Micron Technology, Inc.; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Benefits offered by this job

Medical benefits

Paid time off

Holidays

Job summary

Micron Technology, Inc. in Boise, Idaho, is seeking an HBM Product Development Failure Analysis Engineer to join the PDFA team.

You will apply electrical, physical, and statistical analysis to identify failure mechanisms and drive corrective actions to enable high-yield production of next‑generation HBM devices. The role collaborates with Product, Process, Test, Quality and Manufacturing teams, leveraging AI-enabled analytics to accelerate failure detection, improve reliability, and support

Qualifications

• Bachelor’s degree in Electrical Engineering, Computer Engineering, Physics, or Materials Science.
• 2+ years of experience performing electrical and statistical failure analysis.
• 2+ years of experience applying electrical and physical characterization techniques for semiconductor failure analysis.
• Experience using AI, machine learning, or data analytics tools to support engineering analysis and root cause investigations.
• Coursework or experience in VLSI, semiconductor device physics, semiconductor processing, Python, and statistics.

Responsibilities

• Perform electrical, physical, and statistical failure analysis to identify and understand defect and failure mechanisms in HBM products.
• Analyze component- and system-level data to resolve root causes using statistical techniques, engineering methodologies, and AI-enabled tools.
• Apply AI tools and analytics to enhance failure detection, reliability learning cycles, yield improvement, and component performance.
• Collaborate with Product, Process, Test, Quality, and Manufacturing Engineering teams to resolve fabrication, assembly, and test-related issues.
• Identify process defects, assembly-related failures, and test flow marginalities through detailed data analysis and characterization.
• Communicate technical findings, recommendations, and corrective actions to team members and drive issue resolution across multi-functional teams.
• Support rapid production ramp, product qualification, and continuous reliability improvement initiatives.

Skills

Electrical FA

Statistical analysis

Data analytics

AI tooling

Root cause analysis

Communication

Education

Bachelor’s degree in Electrical Engineering

Bachelor’s degree in Computer Engineering

Bachelor’s degree in Physics

Bachelor’s degree in Materials Science

Tools

Python

JMP

Copilot

Claude

Job description

Micron Technology, Inc. in Boise, Idaho, is seeking an HBM Product Development Failure Analysis Engineer to join the PDFA team.

You will apply electrical, physical, and statistical analysis to identify failure mechanisms and drive corrective actions to enable high-yield production of next‑generation HBM devices. The role collaborates with Product, Process, Test, Quality and Manufacturing teams, leveraging AI-enabled analytics to accelerate failure detection, improve reliability, and support