New College Grad - HBM PYE Product Development Failure Analysis Engineer

Micron Technology, Inc.

Boise (ID)

On-site

USD 85,000 - 120,000

Full time

6 days ago
Be an early applicant

A complete application in a minute

Tailored resume and cover letter, ready to send.

Get past ATS filters

Benefits offered by this job

Medical insurance
Dental insurance
Vision plans
Paid time off
Paid holidays

Job summary

Micron Technology, Inc. is seeking a New College Grad HBM PYE Product Development Failure Analysis Engineer to join the PDFA team.

You will focus on reliability and component-level failure analysis during new HBM introductions, using electrical, physical, and AI-driven data methods to uncover failure mechanisms and enable rapid production ramp. You will collaborate with Product, Process, Quality, and Test Engineering to translate complex data into actionable engineering solutions, supporting

Qualifications

  • Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related technical field.
  • Experience in semiconductor device physics, semiconductor manufacturing processes, or VLSI design.
  • Demonstrated knowledge of statistical analysis techniques and data-driven problem solving.
  • Experience using Python or similar programming languages for data analysis and engineering applications.

Responsibilities

  • Perform electrical, physical, and statistical failure analysis to identify and understand component failure mechanisms.
  • Analyze characterization and manufacturing data to determine root causes of fabrication, assembly, and test-related failures.
  • Collaborate with Product, Process, Quality, and Test Engineering teams to resolve yield, reliability, and process defect issues.
  • Leverage AI-enabled tools and statistical methods to evaluate large datasets, identify trends, and improve component performance.
  • Communicate findings, corrective actions, and risk assessments to multi-functional partners to support successful product qualification and production ramp.

Skills

Python
Statistical analysis
Data analysis
Engineering collaboration

Education

Bachelor's degree in Electrical Engineering

Tools

Statistical software

Job description

Req ID:

JR116583 New College Grad - HBM PYE Product Development Failure Analysis Engineer (Evergreen)

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Product Development Failure Analysis (PDFA) team plays a critical role in bringing next-generation High Bandwidth Memory (HBM) products from initial design through high-volume manufacturing. The team partners closely with Product, Process, Quality, and Test Engineering organizations to identify, analyze, and resolve product and process-related issues that impact yield, reliability, and overall product performance.

As an HBM Product Yield Enhancement PDFA Engineer, you will focus on product reliability and component-level failure analysis during new HBM product introductions. You will use electrical characterization, physical analysis techniques, statistical methodologies, and AI-enabled data analysis tools to identify failure mechanisms and drive rapid production ramp. This role requires strong analytical skills, multi-functional collaboration, and the ability to translate complex data into actionable engineering solutions.

Responsibilities
  • Perform electrical, physical, and statistical failure analysis to identify and understand component failure mechanisms.
  • Analyze characterization and manufacturing data to determine root causes of fabrication, assembly, and test-related failures.
  • Collaborate with Product, Process, Quality, and Test Engineering teams to resolve yield, reliability, and process defect issues.
  • Leverage AI-enabled tools and statistical methods to evaluate large datasets, identify trends, and improve component performance.
  • Communicate findings, corrective actions, and risk assessments to multi-functional partners to support successful product qualification and production ramp.
Minimum Qualifications
  • Bachelor's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related technical field, or equivalent experience.
  • Experience or coursework in semiconductor device physics, semiconductor manufacturing processes, or VLSI design.
  • Demonstrated knowledge of statistical analysis techniques and data-driven problem solving.
  • Experience using Python or similar programming languages for data analysis and engineering applications.
  • Ability to analyze complex technical data and communicate findings effectively in a collaborative engineering environment.
Preferred Qualifications
  • Master's degree in Electrical Engineering, Computer Engineering, Physics, Materials Science, or a related field.
  • Academic or industry experience in semiconductor failure analysis, yield enhancement, reliability engineering, or product characterization.
  • Experience applying AI, Generative AI, or AI-assisted analytical tools to support engineering investigations and data analysis.
  • Knowledge of test methodologies, process integration, and advanced memory technologies, including HBM products.
  • Experience working with large datasets and applying statistical software or machine learning techniques to identify failure trends and process improvements.
Job Profile(s):

Product Development Engineer 1 - Product Development Engineer 2

Relocation Level:

TBD

Before Getting Started

Please review Micron’s Internal Job Application Policy on your regional PeopleNow Career Opportunities page before searching and applying for jobs. Note in particular that:

  • Hiring managers may view your performance appraisals, original resume, transcripts or other performance-related documentation in your personal file. This information will be held in confidence.
  • If you are selected to interview for a position, you must notify your direct supervisor before participating in the interview process.

As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on Benefits | Micron Technology, Inc

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

To learn about your right to work click here.

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at hrsupport_na@micron.com or 1-800-336-8918 (select option #3)

Get your free, confidential resume review.

or drag and drop your file here.

Similar jobs

Similar jobs worth comparing

New College Grad - HBM PYE Product Development Failure Analysis Enginee
New College Grad - HBM PYE Product Development Failure Analysis Enginee

Micron • Boise (ID)

On-site
USD 110,000 - 160,000
New College Grad - HBM PYE Product Development Failure Analysis Enginee
New College Grad - HBM PYE Product Development Failure Analysis Enginee

1000 Micron Technology, Inc. • Boise (ID)

On-site
USD 110,000 - 140,000
Medical plans
Dental plans
Vision plans
+3
Staff HBM PYE Product Development Failure Analysis Engineer
Staff HBM PYE Product Development Failure Analysis Engineer

Micron Technology, Inc. • Boise (ID)

On-site
USD 110,000 - 170,000
HBM PYE Product Development Failure Analysis Engineer Boise, Idaho, United States of America Posted 21 hours ago
HBM PYE Product Development Failure Analysis Engineer Boise, Idaho, United States of America Posted 21 hours ago

Micron Technology, Inc. • Boise (ID)

On-site
USD 120,000 - 180,000
Medical benefits
Paid time off
Holidays
Product Pathfinding Engineer- HIG-TPG
Product Pathfinding Engineer- HIG-TPG

Micron Technology • Boise (ID)

On-site
USD 110,000 - 160,000
PYE (Product Yield Enhancement) Lab Technician
PYE (Product Yield Enhancement) Lab Technician

Micron Technology • Boise (ID)

On-site
USD 60,000 - 90,000
New College Grad - ENG, HIG HBM PSE Design Validation
New College Grad - ENG, HIG HBM PSE Design Validation

Micron Technology, Inc. • Boise (ID)

On-site
USD 90,000 - 130,000
New College Grad - Product Yield Enhancement Engineer, HBM Boise, Idaho, United States of America
New College Grad - Product Yield Enhancement Engineer, HBM Boise, Idaho, United States of America

Micron Technology, Inc. • Boise (ID)

On-site
USD 70,000 - 110,000
Medical, dental, and vision plans
Paid time off
Paid holidays
Senior Engineer - HIG HBM PSE - Design Validation Boise, Idaho, United States of America Posted a day ago
Senior Engineer - HIG HBM PSE - Design Validation Boise, Idaho, United States of America Posted a day ago

Micron Technology, Inc. • Boise (ID)

On-site
USD 120,000 - 180,000
Medical insurance
Dental insurance
Vision insurance
+2
Intern - Engineer, HIG HBM DTPCO
Intern - Engineer, HIG HBM DTPCO

Micron Technology, Inc. • Richardson (TX)

On-site
USD 110,000 - 150,000
Medical plan
Dental plan
Vision plan
+2