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Micron Technology, Inc. is seeking a New College Grad HBM PYE Product Development Failure Analysis Engineer to join the PDFA team.
You will focus on reliability and component-level failure analysis during new HBM introductions, using electrical, physical, and AI-driven data methods to uncover failure mechanisms and enable rapid production ramp. You will collaborate with Product, Process, Quality, and Test Engineering to translate complex data into actionable engineering solutions, supporting
Req ID:
JR116583 New College Grad - HBM PYE Product Development Failure Analysis Engineer (Evergreen)
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
The Product Development Failure Analysis (PDFA) team plays a critical role in bringing next-generation High Bandwidth Memory (HBM) products from initial design through high-volume manufacturing. The team partners closely with Product, Process, Quality, and Test Engineering organizations to identify, analyze, and resolve product and process-related issues that impact yield, reliability, and overall product performance.
As an HBM Product Yield Enhancement PDFA Engineer, you will focus on product reliability and component-level failure analysis during new HBM product introductions. You will use electrical characterization, physical analysis techniques, statistical methodologies, and AI-enabled data analysis tools to identify failure mechanisms and drive rapid production ramp. This role requires strong analytical skills, multi-functional collaboration, and the ability to translate complex data into actionable engineering solutions.
Product Development Engineer 1 - Product Development Engineer 2
TBD
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