HBM Memory Design Engineer – AI/ML Silicon Innovator

Micron Technology

Richardson (TX)

Sur place

USD 120 000 - 170 000

Plein temps

14 jours+
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Résumé du poste

Micron Technology, Inc. in Richardson, Texas, is seeking a Circuit/Memory Design Engineer to advance HBM/TSV memory solutions for AI and ML applications.

You will collaborate across circuit design, layout, and validation, applying Verilog, SPICE, and RTL methodologies to deliver high‑quality memory products while partnering with global teams to optimize cost, quality, reliability, and time‑to‑market.

Qualifications

  • Bachelor’s degree in Electrical Engineering or equivalent practical experience.
  • 4+ years of relevant experience with a Bachelor’s degree, or 2+ years with a Master’s degree.
  • Extensive knowledge of CMOS circuit design and semiconductor device physics.
  • Experience with schematic entry, Verilog, FastSPICE, and HSPICE simulations.
  • Strong understanding of timing, area, power, and complexity trade-offs in DRAM or mixed-signal design.

Responsabilités

  • Contribute to circuit design, layout, and optimization for memory and logic or analog circuits.
  • Perform parasitic modeling and support design validation, including reticle experiments and required tape-out revisions.
  • Oversee and manage the layout process, including floor-planning, placement, and routing.
  • Perform verification using modeling, simulation and AI assisted analysis with industry-standard simulators.
  • Collaborate across teams to drive standardization and shared design success.
  • Partner with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering to support accurate manufacturability.

Connaissances

CMOS design
Verilog
FastSPICE
HSPICE
RTL design
Python scripting
Timing analysis

Formation

Bachelor's in Electrical Engineering
Master's degree

Outils

Simulation tools
EDA tools

Description du poste

Micron Technology, Inc. in Richardson, Texas, is seeking a Circuit/Memory Design Engineer to advance HBM/TSV memory solutions for AI and ML applications.

You will collaborate across circuit design, layout, and validation, applying Verilog, SPICE, and RTL methodologies to deliver high‑quality memory products while partnering with global teams to optimize cost, quality, reliability, and time‑to‑market.

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