HBM Memory Design Engineer – AI/ML Silicon Innovator

Micron Technology; Richardson (TX); On-site; USD 120,000 - 170,000; Full time

Job summary

Micron Technology, Inc. in Richardson, Texas, is seeking a Circuit/Memory Design Engineer to advance HBM/TSV memory solutions for AI and ML applications.

You will collaborate across circuit design, layout, and validation, applying Verilog, SPICE, and RTL methodologies to deliver high‑quality memory products while partnering with global teams to optimize cost, quality, reliability, and time‑to‑market.

Qualifications

• Bachelor’s degree in Electrical Engineering or equivalent practical experience.
• 4+ years of relevant experience with a Bachelor’s degree, or 2+ years with a Master’s degree.
• Extensive knowledge of CMOS circuit design and semiconductor device physics.
• Experience with schematic entry, Verilog, FastSPICE, and HSPICE simulations.
• Strong understanding of timing, area, power, and complexity trade-offs in DRAM or mixed-signal design.

Responsibilities

• Contribute to circuit design, layout, and optimization for memory and logic or analog circuits.
• Perform parasitic modeling and support design validation, including reticle experiments and required tape-out revisions.
• Oversee and manage the layout process, including floor-planning, placement, and routing.
• Perform verification using modeling, simulation and AI assisted analysis with industry-standard simulators.
• Collaborate across teams to drive standardization and shared design success.
• Partner with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering to support accurate manufacturability.

Skills

CMOS design

Verilog

FastSPICE

HSPICE

RTL design

Python scripting

Timing analysis

Education

Bachelor's in Electrical Engineering

Master's degree

Tools

Simulation tools

EDA tools

Job description

Micron Technology, Inc. in Richardson, Texas, is seeking a Circuit/Memory Design Engineer to advance HBM/TSV memory solutions for AI and ML applications.

You will collaborate across circuit design, layout, and validation, applying Verilog, SPICE, and RTL methodologies to deliver high‑quality memory products while partnering with global teams to optimize cost, quality, reliability, and time‑to‑market.