HBM Design Architect Intern — AI-Driven Semiconductors

Micron Technology; Richardson (TX); On-site; USD 28,000 - 55,000; Full time

Job summary

Micron Technology is seeking an HBM Design Architect Intern to assess HBM and DRAM architecture concepts, build analytical models, and study design tradeoffs affecting performance, power, and manufacturability. You will work with senior architects and engineers, leveraging AI tools to support design exploration and productivity.

The internship offers hands-on semiconductor architecture exposure and collaboration across architecture, design, verification, packaging, and product teams, with

Qualifications

• Pursuing a Master’s or Ph.D. in EE/CE and planning to return to the degree program.
• Strong foundation in multiple areas listed above (core semiconductor topics).
• Experience with engineering analysis, modeling, or simulation tools.
• Excellent problem-solving and communication skills.

Responsibilities

• Analyze HBM and DRAM architecture tradeoffs related to timing, bandwidth, power, area, thermal performance, reliability, and design complexity using analytical, simulation, and AI Assisted methodologies.
• Develop first‑order models, simulations, and data‑analysis tools to compare design alternatives, identify key sensitivities, and support architecture pathfinding studies.
• Collaborate with architecture, circuit design, verification, layout, packaging, product, and system engineering teams to evaluate implementation feasibility and technology tradeoffs.
• Review simulation, experimental, and silicon data to perform root‑cause analysis, validate assumptions, improve model accuracy, and develop evidence‑based recommendations.
• Apply Large Language Models (LLMs), Generative AI, and AI Assisted engineering workflows to enhance engineering analysis, technical research, and productivity while documenting and presenting findings to multi‑functional teams.

Skills

CMOS circuits

digital/mixed-signal design

semiconductor devices

computer architecture

memory systems

thermal sciences

power delivery

signal integrity

advanced packaging

Education

Master’s or Ph.D. in Electrical Engineering or Computer Engineering or related field

Tools

HSPICE

FineSim

Spectre

Job description

Micron Technology is seeking an HBM Design Architect Intern to assess HBM and DRAM architecture concepts, build analytical models, and study design tradeoffs affecting performance, power, and manufacturability. You will work with senior architects and engineers, leveraging AI tools to support design exploration and productivity.

The internship offers hands-on semiconductor architecture exposure and collaboration across architecture, design, verification, packaging, and product teams, with