HBM Design Architect: End-to-End DFT & Test Strategy

Micron Technology; Richardson (TX); On-site; USD 146,000 - 297,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Paid family leave

Paid time-off program

Paid holidays

Job summary

Micron Technology is seeking an HBM Design Architect based in Richardson, Texas. This full-time role involves defining and implementing testing architectures for next-generation memory products. The ideal candidate should have a Bachelor's or Master’s degree in Electrical or Computer Engineering, strong knowledge of semiconductor testing processes, and over 5 years of DFT design experience. The salary range is $146,000.00 - $297,000.00 annually, plus benefits and bonuses.

Qualifications

• Bachelor's or Master’s degree in relevant field.
• Experience with semiconductor flows and DFT.
• Knowledge of advanced memory products is a plus.

Responsibilities

• Define and implement end-to-end DFT architectures.
• Develop strategies for stacked-die test flows.
• Collaborate across design, verification, layout, test, and manufacturing teams.

Skills

Strong knowledge of scan, MBIST, JTAG, and boundary scan concepts

Experience with wafer probe and final test semiconductor flows

5+ years of experience in DRAM or ASIC DFT design or verification

Education

Bachelor's or Master’s degree in Electrical Engineering, Computer Engineering, or related field

Job description

Micron Technology is seeking an HBM Design Architect based in Richardson, Texas. This full-time role involves defining and implementing testing architectures for next-generation memory products. The ideal candidate should have a Bachelor's or Master’s degree in Electrical or Computer Engineering, strong knowledge of semiconductor testing processes, and over 5 years of DFT design experience. The salary range is $146,000.00 - $297,000.00 annually, plus benefits and bonuses.