Senior HBM Customer Integration Tech Lead

Micron; Boise (ID); On-site; USD 140,000 - 190,000; Full time

Job summary

Micron Technology seeks a Technical Leader within CETL to serve as a key technical interface between customers and internal engineering teams. You will translate customer requirements into actionable design and process improvements for HBM products, and mentor cross-functional teams across front-end and back-end operations.

The role emphasizes AI-enabled automation and collaboration with product engineering and manufacturing.

Qualifications

• Bachelor’s or Master’s in Electrical or Computer Engineering or related field.
• Minimum 10+ years in semiconductor product engineering or system integration.
• Hands-on experience with HBM design, packaging, and manufacturing processes.

Responsibilities

• Understand customer systems and translate needs to internal teams.
• Mentor teams on HBM architecture, signal integrity, and thermal solutions.
• Lead technical discussions, reviews, and root-cause analysis with customers.
• Develop and deploy AI systems to automate engineering workflows.
• Collaborate across front-end/back-end process engineering and manufacturing.

Skills

Customer facing comms

Technical mentoring

Cross-functional teamwork

Problem solving

Education

Bachelor’s or Master’s in Electrical or Computer Engineering

Tools

HBM architecture

Packaging & manufacturing

Job description

Micron Technology seeks a Technical Leader within CETL to serve as a key technical interface between customers and internal engineering teams. You will translate customer requirements into actionable design and process improvements for HBM products, and mentor cross-functional teams across front-end and back-end operations.

The role emphasizes AI-enabled automation and collaboration with product engineering and manufacturing.