HBM Customer Integration Tech Leader — AI-Driven Solutions

Micron Technology; Boise (ID); On-site; USD 150,000 - 190,000; Full time

Job summary

Micron Technology is seeking a Technical Leader in the CETL function to serve as the technical interface between external customers and internal engineering teams in Boise, Idaho. You will translate customer requirements into actionable design and process plans for HBM integration and manufacturing.

This role emphasizes problem-solving, cross‑functional collaboration, and leadership of engineering capabilities powered by intelligent technology to accelerate product development, validation, and

Qualifications

• Bachelor’s or Master’s degree in Electrical or Computer Engineering.
• 10+ years in semiconductor product engineering or customer-facing roles.
• Hands-on experience with HBM architecture, packaging, and manufacturing.
• Ability to map customer requirements to internal design and process capabilities.
• Excellent communication across technical and non-technical teams.

Responsibilities

• Understand customer system architecture and integration challenges.
• Translate customer needs into actionable internal requirements.
• Provide mentorship on HBM architecture, signal integrity, thermal solutions, packaging.
• Develop and deploy AI systems to automate processes.
• Coordinate with front-end/back-end teams for seamless integration.
• Support design reviews and yield improvement initiatives.

Skills

HBM architecture

Packaging strategies

AI systems deployment

Cross-functional teamwork

Customer communication

Education

Electrical/Computer Engineering degree

Job description

Micron Technology is seeking a Technical Leader in the CETL function to serve as the technical interface between external customers and internal engineering teams in Boise, Idaho. You will translate customer requirements into actionable design and process plans for HBM integration and manufacturing.

This role emphasizes problem-solving, cross‑functional collaboration, and leadership of engineering capabilities powered by intelligent technology to accelerate product development, validation, and