New College Grad - Process Integration Engineer, APTD

Micron Technology, Inc; Boise (ID); Vor Ort; USD 90.000 - 120.000; Vollzeit

Benefits dieser Stelle

Medical, dental and vision plans

Paid time off

Paid holidays

Zusammenfassung

Micron Technology, Inc. seeks a Process Integration Engineer in Advanced Packaging Technology Development (APTD) to develop and integrate packaging solutions for next‑generation semiconductor products at our Boise, Idaho site.

You will collaborate with multi‑functional teams, perform process development and technology qualification, and apply data‑driven methods to improve performance. Ideal candidates hold a master's degree in a relevant field and have experience in semiconductor packaging,

Qualifikationen

• Master's degree or equivalent in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or related field.
• Experience with semiconductor packaging, process integration, materials engineering, device physics, or related areas.
• Demonstrated analytical and problem-solving skills through projects, internships, or research.
• Ability to collaborate in a multi-functional team and communicate complex concepts clearly.
• Experience with data analysis tools and willingness to learn AI-assisted technologies.

Aufgaben

• Support the development, characterization, and integration of packaging and interconnect solutions for next-gen semiconductor products.
• Collaborate with multi-functional teams to analyze data, solve technical challenges, and improve performance.
• Participate in experiments, process evaluations, and technology qualification activities.
• Utilize data-driven tools to identify trends and support technical decisions.
• Promote safety, quality, and continuous learning.

Kenntnisse

Data analysis

Collaboration

Problem solving

Communication

AI-assisted tools

Ausbildung

Master's degree (Electrical / Materials / Mechanical / Physics / Chemistry)

Tools

Statistical methods

Design of Experiments

Laboratory techniques

Jobbeschreibung

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

The Technology Development (TD) department at Micron Technology leads innovation. It drives the advancement of data retention and storage systems that change how the world uses information. The team develops next-generation semiconductor processes and technologies and works closely with global R&D and manufacturing teams to bring innovative solutions from concept to production. Join a collaborative environment where you will help shape the future of semiconductor technology while working alongside experienced engineers and technical leaders.

Position Overview

As a Process Integration Engineer in Advanced Packaging Technology Development (APTD), your role includes developing advanced packaging approaches and linking technologies. You will contribute to their integration in future semiconductor products. Working in a highly collaborative R&D environment, you will support process development, technology evaluation, and qualification activities while gaining hands‑on experience with modern semiconductor technologies. This role provides an excellent opportunity for engineers who are passionate about innovation, problem‑solving, and continuous learning.

Responsibilities

• Support the development, characterization, and integration of groundbreaking packaging and interconnect solutions for next-generation semiconductor products.
• Collaborate with multi‑functional engineering teams to analyze process data, solve technical challenges, and improve technology performance.
• Participate in experiments, process evaluations, and technology qualification activities to support development objectives.
• Utilize AI‑enabled and data‑driven tools to analyze engineering results, identify trends, and support technical decision‑making.
• Promote a culture of safety, quality, compliance, and continuous learning.

Minimum Qualifications

• Master's degree or equivalent experience in Electrical Engineering, Materials Science, Mechanical Engineering, Physics, Chemistry, or a related engineering/science field.
• Knowledge of semiconductor manufacturing, process integration, materials engineering, device physics, or advanced packaging through coursework, research, internships, or industry experience.
• Demonstrated analytical and problem‑solving skills through academic research, internships, laboratory work, or engineering projects.
• Ability to work effectively in a collaborative, multi‑functional team environment and communicate technical concepts clearly.
• Experience using data analysis tools and a willingness to learn AI‑assisted technologies that improve engineering productivity and decision‑making.

Preferred Qualifications

• Internship, co‑op, research, or academic project experience related to semiconductor process development, advanced packaging, materials characterization, or manufacturing technologies.
• Familiarity with advanced packaging concepts such as wafer‑level packaging, fan‑out packaging, 2.5D/3D integration, wirebond, microbump, or hybrid bonding.
• Experience analyzing experimental data using statistical methods, Design of Experiments (DoE), or related engineering techniques.
• Understanding of semiconductor devices, memory technologies (DRAM/NAND), or logic process technologies.
• Demonstrated leadership, initiative, or project ownership through research, student organizations, internships, or team‑based engineering projects.

Benefits

• We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget.
• Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave.
• Additionally, Micron benefits include a robust paid time‑off program and paid holidays.

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

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To learn more about Micron, please visit micron.com/careers

For US Sites Only: To request assistance with the application process and/or for reasonable accommodations, please contact Micron’s People Organization at [e-mail] or 1-800-336-8918 (select option #3)

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.