Global TPM Director, AI/Datacenter Power Packaging

Renesas Electronics Corp.

Austin (TX)

On-site

USD 300,000 - 350,000

Full time

14 days+

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Job summary

Renesas Electronics Corp. in Austin, TX is seeking a Sr. Director, Technical Program Management to lead a global TPM organization driving AI/Datacenter Infrastructure Power NPI and package engineering programs.

You will partner with multiple product and marketing teams to ensure schedules, quality, and production readiness meet commitments. The role requires 15–20+ years in semiconductor programs, strong leadership, and a proven ability to manage complex cross-functional initiatives across

Qualifications

15–20+ years of experience in semiconductor engineering, product development, applications, package development, NPI, manufacturing, TPM or a closely related field.
Proven track record leading complex semiconductor NPI programs involving package development, assembly, qualification, reliability, and manufacturing ramp.
Strong understanding of qualification, reliability, SPC/statistical methods, process development, risk management, and structured problem-solving methodologies.

Responsibilities

Lead the global Technical Program Management organization supporting AI/Datacenter Infrastructure Power NPI and package engineering programs.
Partner with Package Engineering Directors who lead technical package development programs, providing program-level execution leadership, governance, and accountability.
Establish end-to-end NPI program plans, milestones, critical paths, resource alignment, risk management, and executive reporting.
Create a disciplined program management operating model covering development, qualification, customer requirements, production readiness, ramp, and transition to volume manufacturing.
Proactively identify technical, quality, reliability, supply, manufacturing, and schedule risks; establish mitigation plans and escalates critical issues with clear recommendations.
Lead cross-functional technical task forces for major development challenges affecting quality, reliability, yield, manufacturability, qualification, or NPI schedule.
Drive structured problem solving and closure of critical issues using data-driven methods, root-cause analysis, risk assessment, and defined corrective/preventive actions.
Coordinate with Package Engineering, Power product group partners—Design, Application, Marketing—Product Engineering, Reliability, Quality, Operations, Supply Chain to remove barriers and maintain momentum.
Establish program dashboards and management systems for milestones, critical path activities, risks, issues, action owners, and recovery plans.
Lead TPM activities with OSAT/CM partners, including reviews, milestone tracking, escalation, recovery plans, qualification readiness, and ramp execution.
Ensure EBRs are executed per schedule at each OSAT with timely recovery actions.
Develop TPM teams at OSATs, aligning with Renesas priorities and global NPI schedules.
Ensure OSAT/CM development activities, DOE, process optimization, qualification, production controls, and ramp readiness align with NPI objectives.
Drive timely resolution of process integration and assembly issues impacting quality, reliability, yield, or commitments.
Ensure seamless transition from development into production with readiness reviews, ramp monitoring, and issue management.
Establish standardized program management processes, templates, metrics, escalation mechanisms, and lessons learned.
Provide executive, fact-based communication on program health, risks, schedules, and decisions required from senior leadership.
Build relationships with OSAT/CM leadership to improve responsiveness and execution of AI/Datacenter Power programs.
Develop TPM organization capabilities and a high-performance execution culture.
Support packaging technology roadmap by translating priorities into executable programs and deliverables.
Address internal/external customer-impacting issues with Marketing, Product, Quality, Operations, and Package Engineering teams.