Substrate Quality & Reliability Engineer (Onsite)

Intel; Phoenix (AZ); Hybrid; USD 104,000 - 199,000; Full time

Job summary

Intel is seeking a Substrate Quality and Reliability Engineer to drive substrate capacity expansion and influence technology decisions for Intel package and assembly. You will enable qual plans and strategies to meet milestones and assess risks at the substrate level.

The role requires onsite presence with a hybrid work option. You will interact with cross-functional teams to develop and validate testing, inspection, and reliability screens for future high-volume manufacturing.

Qualifications

• Master's degree with 2+ years of industry experience OR PhD in a related engineering discipline.
• 2+ years of experience in substrate manufacturing, semiconductor fabrication, package assembly, wafer-level processing, or board/system integration.
• Demonstrated ability to collaborate across cross-functional teams.

Responsibilities

• Develop, apply, and maintain quality and reliability standards for Substrate packaging components.
• Define inspection, screening, and testing mechanisms to mitigate yield and reliability risks.
• Develop reliability models through statistical analysis to categorize risk.
• Deliver standardization in qualification and manufacturing quality systems.
• Engage with packaging technology development and partner engineering teams to lower risks.

Education

Master's or PhD in Materials Science / Electrical Engineering / Physics / Chemistry / Mechanical Engineering / Aerospace Engineering / Chemical Engineering

Tools

Python

SQL

Statistics

Job description

Intel is seeking a Substrate Quality and Reliability Engineer to drive substrate capacity expansion and influence technology decisions for Intel package and assembly. You will enable qual plans and strategies to meet milestones and assess risks at the substrate level.

The role requires onsite presence with a hybrid work option. You will interact with cross-functional teams to develop and validate testing, inspection, and reliability screens for future high-volume manufacturing.