Substrate Quality & Reliability Engineer — Hybrid Onsite

Intel Corporation

Phoenix, Northern (AZ, KY)

Hybrid

USD 104,000 - 199,000

Full time

6 days ago
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Benefits offered by this job

Stock bonuses
Health benefits
Retirement plan
Vacation

Job summary

Intel Corporation in Phoenix, AZ is seeking a Substrate Quality and Reliability Engineer to drive substrate capacity expansion, enable quality plans, and assess risks for future HVM stability. You will influence process technologies and collaborate with packaging development teams to reduce customer-facing issues and improve product quality.

The role requires building reliability models, defining testing methods, and leading proactive improvements across substrate manufacturing and integration

Qualifications

  • Master's degree with 2+ years in target field.
  • 2+ years in substrate manufacturing, semiconductor fabrication, or package assembly.
  • Ability to collaborate across cross-functional teams.

Responsibilities

  • Develop, apply, and maintain quality and reliability standards for Substrate packaging components.
  • Define inspection, screening, and testing mechanisms to mitigate yield and reliability risks.
  • Develop reliability models and perform statistical analysis to assess risks to customer specs.

Skills

Substrate manufacturing
Semiconductor fabrication
Package assembly
Wafer-level processing
Board/system integration
Data analysis
Python
SQL
Cross-functional collaboration
Problem solving

Education

Master's degree in Materials Science or Engineering
PhD in a related engineering discipline

Tools

Python
SQL

Job description

Intel Corporation in Phoenix, AZ is seeking a Substrate Quality and Reliability Engineer to drive substrate capacity expansion, enable quality plans, and assess risks for future HVM stability. You will influence process technologies and collaborate with packaging development teams to reduce customer-facing issues and improve product quality.

The role requires building reliability models, defining testing methods, and leading proactive improvements across substrate manufacturing and integration

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