Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Sta[...]

Micron Technology, Inc; Boise (ID); On-site; USD 100,000 - 130,000; Full time

Benefits offered by this job

Medical, dental, and vision plans

Income protection

Paid family leave

Robust paid time-off program

Paid holidays

Job summary

Micron Technology, Inc is currently seeking a Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal). This role requires leading the global Product Integration efforts and improving yield and quality across technologies.

The ideal candidate will have a strong background in electrical engineering or related fields. Micron offers a comprehensive benefits package that includes medical, dental, and paid time-off programs, among other advantages.

Qualifications

• 2+ years of experience in Product Integration, Test, Yield, Design Engineering, or BEOL semiconductor process integration.
• Strong understanding of semiconductor device physics, DRAM product operation, wafer fabrication, and electrical/parametric testing.
• Ability to work independently in a cross‑functional, global environment, manage multiple priorities, and travel 20–50%.

Responsibilities

• Lead global Product Integration efforts to improve yield, quality, and benchmark performance.
• Integrate and drive execution of project data to closure.
• Deliver yield improvements through understanding of product design and manufacturing.

Skills

Data analysis

Debugging

Technical problem solving

Strong communication

Education

Bachelor’s, Master’s, or PhD in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science

Job description

Micron Technology is a world leader in memory and storage solutions, accelerating the transformation of information into intelligence.

Job Title

Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Staff / Principal)

Key Responsibilities

• Lead global Product Integration efforts to improve yield, quality, and benchmark performance across technologies and products.
• Integrate and drive execution of cross‑site project data (design, test, yield, manufacturing) to closure.
• Deliver yield improvements through end‑to‑end understanding of product design, test flow, packaging interaction, and manufacturing, balancing reliability requirements.
• Define and execute strategies to ensure Packaging Technology and Chip‑Package Interaction readiness ahead of product qualification.
• Lead cross‑functional, global task forces to resolve yield and quality issues efficiently. Develop, standardize, and deploy best‑known methods (BKMs) and business processes to improve productivity.
• Communicate status, risks, and technical proposals clearly and partner with leadership to drive results. Travel to Micron fab and development sites as needed to support execution and alignment.

Minimum Qualifications

• Bachelor’s, Master’s, or PhD in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science, or a related field.
• 2+ years of experience in Product Integration, Test, Yield, Design Engineering, or BEOL semiconductor process integration.
• Strong understanding of semiconductor device physics, DRAM product operation, wafer fabrication, and electrical/parametric testing.
• Proven ability in data analysis, debugging, and technical problem solving, with strong written and verbal communication skills.
• Ability to work independently in a cross‑functional, global environment, manage multiple priorities, and travel 20–50%.

Preferred Qualifications

• Experience with DRAM High Bandwidth Memory (HBM) products.
• Exposure to advanced DRAM technologies such as HPM, advanced packaging, chip‑package interaction, BEOL integration, or layout topics.
• Experience collaborating across Product, Test, Yield, Design, Packaging, and Manufacturing teams.
• Demonstrated ability to drive alignment and execution in central or network‑level roles.
• Strong interest in innovation, continuous improvement, and scalable solution development.

Job Profile

• FAB Engineer 4
• Relocation Level: TBD

Benefits

Micron offers a comprehensive benefits package, including medical, dental, and vision plans, income protection, paid family leave, a robust paid time‑off program, and paid holidays.

Equal Opportunity Employment

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.