Front End Central Product Integration Engineer – Test & Product Yield Integration (Senior / Sta[...]

Micron Technology; Boise (ID); On-site; USD 110,000 - 140,000; Full time

Job summary

Micron Technology, a global leader in memory and storage innovation, seeks a Product Integration engineer to lead global initiatives that improve yield, quality, and benchmark performance across technologies and products. You will integrate cross-site project data (design, test, yield, manufacturing), define end-to-end flow improvements, and drive readiness ahead of product qualification.

The role requires strong data analysis, cross-functional collaboration, and the ability to travel 20–50% to

Qualifications

• 2+ years in Product Integration, Test, Yield, Design Engineering, or BEOL semiconductor process integration.
• Strong understanding of semiconductor device physics, DRAM product operation, wafer fabrication, and electrical/parametric testing.
• Proven data analysis, debugging, and problem solving, with strong written and verbal communication skills.
• Ability to work independently in a cross‑functional, global environment, manage multiple priorities, and travel 20–50%.

Responsibilities

• Lead global Product Integration efforts to improve yield, quality, and benchmark performance across technologies and products.
• Integrate and drive execution of cross‑site project data (design, test, yield, manufacturing) to closure.
• Deliver yield improvements through end‑to‑end understanding of product design, test flow, packaging interaction, and manufacturing, balancing reliability requirements.
• Define and execute strategies to ensure Packaging Technology and Chip‑Package Interaction readiness ahead of product qualification.
• Lead cross‑functional, global task forces to resolve yield and quality issues efficiently. Develop, standardize, and deploy BKMs and business processes to improve productivity.
• Communicate status, risks, and technical proposals clearly and partner with leadership to drive results. Travel to Micron fab and development sites as needed to support execution and alignment.

Skills

Data analysis

Problem solving

Cross-functional collaboration

Verbal & written communication

Travel readiness 20-50%

Education

Bachelor’s/Master’s/PhD in Electrical Engineering or related field

Job description

Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a global leader in memory and storage innovation, accelerating the transformation of data into intelligence to drive progress worldwide.

Key Responsibilities

• Lead global Product Integration efforts to improve yield, quality, and benchmark performance across technologies and products.
• Integrate and drive execution of cross‑site project data (design, test, yield, manufacturing) to closure.
• Deliver yield improvements through end‑to‑end understanding of product design, test flow, packaging interaction, and manufacturing, balancing reliability requirements.
• Define and execute strategies to ensure Packaging Technology and Chip‑Package Interaction readiness ahead of product qualification.
• Lead cross‑functional, global task forces to resolve yield and quality issues efficiently. Develop, standardize, and deploy best‑known methods (BKMs) and business processes to improve productivity.
• Communicate status, risks, and technical proposals clearly and partner with leadership to drive results. Travel to Micron fab and development sites as needed to support execution and alignment.

Minimum Qualifications

• Bachelor’s, Master’s, or PhD in Electrical Engineering, Microelectronics, Physics, Chemistry, Materials Science, or a related field.
• 2+ years of experience in Product Integration, Test, Yield, Design Engineering, or BEOL semiconductor process integration.
• Strong understanding of semiconductor device physics, DRAM product operation, wafer fabrication, and electrical/parametric testing.
• Proven ability in data analysis, debugging, and technical problem solving, with strong written and verbal communication skills.
• Ability to work independently in a cross‑functional, global environment, manage multiple priorities, and travel 20–50%.

Preferred Qualifications

• Experience with DRAM High Bandwidth Memory (HBM) products.
• Exposure to advanced DRAM technologies such as HPM, advanced packaging, chip‑package interaction, BEOL integration, or layout topics.
• Experience collaborating across Product, Test, Yield, Design, Packaging, and Manufacturing teams.
• Demonstrated ability to drive alignment and execution in central or network‑level roles.
• Strong interest in innovation, continuous improvement, and scalable solution development.

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations, benefit programs that help protect your income if you are unable to work due to illness or injury, paid family leave, a robust paid time‑off program and paid holidays.

Micron is proud to be an equal‑opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.

AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.

Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website.