Frontend Central Product Integration Engineering (cPIE) Transformative HVB (high-value-bits) En[...]

1000 Micron Technology, Inc.; Boise (ID); On-site; USD 80,000 - 110,000; Full time

Benefits offered by this job

Medical, dental and vision plans

Paid time-off and holidays

Income protection programs

Job summary

1000 Micron Technology, Inc. is looking for an experienced engineer to enhance its product integration processes. The role demands a strong educational background in Electrical Engineering or related fields, along with hands-on experience in the semiconductor industry.

Key responsibilities include optimizing design processes, developing performance models, and collaborating with cross-functional teams to implement solutions. Candidates must excel in data-driven analytics and possess a commitment to continuous improvement in a fast-paced environment.

Qualifications

• 2+ years of experience in the semiconductor industry, specifically within Product Integration Engineering.
• In-depth understanding of semiconductor manufacturing processes and equipment.
• Proven ability to multitask and perform root-cause analysis.

Responsibilities

• Initiate data-driven solutions targeting yield optimization.
• Develop models for tool performance benchmarking.
• Lead teams to ensure successful project execution.

Skills

Data analysis with Python

Problem-solving ability

Technical knowledge in semiconductor manufacturing

Education

Bachelor’s, Master’s, or PhD in Electrical Engineering, Materials Science, Physics

Tools

Y3

JMP

Job description

Overview

Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

Responsibilities

• Process & Design Improvement: Initiate data‑driven solutions to identify test, design, and integration opportunities, specifically targeting high‑value bits and yield optimization.
• Performance Modeling: Develop models to benchmark tool performance and implement equipment prognostics for process integration optimization.
• Strategic Collaboration: Partner with Process, Equipment, Manufacturing, and Data Science teams to prototype initiatives and demonstrate clear business value.
• Global Solution Delivery: Collaborate with Global Quality, Product Engineering, and external suppliers to deploy “Best Known Method” (BKM) solutions to production.
• Cross‑Functional Implementation: Lead multi‑functional teams to ensure seamless communication and successful project execution across global sites.
• System Optimization: Facilitate the redefinition of current methods and systems to achieve “Best in Industry” status through continuous innovation.
• Global Business Support: Manage priorities and system enhancements to improve global business processes, maintaining a high level of detail and independence.
• Agile Mindset & Availability: Demonstrate a strong growth mindset with the flexibility to support engineering teams during non‑standard hours as needed.

Minimum Qualifications

• Education: Bachelor’s, Master’s, or PhD in Electrical Engineering, Materials Science, Physics, or a related technical field.
• Experience: 2+ years of experience in the semiconductor industry, specifically within Product Integration Engineering (PIE), Test Solutions, Product Engineering, or Circuit Design.
• Data Analysis: 2+ years of experience performing data analysis and numerical experiments using tools such as Y3, JMP, or Python.
• Technical Knowledge: In‑depth understanding of semiconductor manufacturing processes, equipment, and control systems.
• Problem Solving: Proven ability to multitask, perform root‑cause analysis, and make data‑driven decisions in a fast‑paced environment.

Preferred Qualifications

• Integration: Strong understanding of Front‑End (FE) or Back‑End (BE) process and product integration.
• Advanced Analytics: Proficiency in Statistical Modeling, Machine Learning (ML), or AI‑driven yield analysis.
• Domain Expertise: Experience with DRAM, HBM (High Bandwidth Memory), or advanced packaging technologies.
• Critical Thinking: Demonstrated ability to identify process gaps and implement innovative yield improvement solutions.

Benefits

Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time‑off program and paid holidays. For additional information regarding the Benefit programs available, please see the Benefits Guide posted on micron.com/careers/benefits.

Equal Opportunity Statement

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.