Uniformity Staff/Principal Engineer, Front End, Central Product Integration (FE cPIE)

Micron Technology, Inc; Boise (ID); On-site; USD 100,000 - 130,000; Full time

Benefits offered by this job

Medical coverage

Dental coverage

Vision coverage

Paid family leave

Paid time-off

Paid holidays

Job summary

Micron Technology, Inc is seeking a Uniformity Staff/Principal Engineer to lead process integration strategies for critical modules in Boise, Idaho. You will work closely with cross-module process owners and apply model-based analysis to enhance product integration and ensure structural uniformity.

Ideal candidates will have a PhD or equivalent experience, strong problem-solving skills, and a background in the semiconductor industry. Enjoy comprehensive benefits including medical, dental, and paid time-off.

Qualifications

• 5+ years’ experience in a process-related role in the semiconductor industry.
• Understanding of DRAM and NAND operation and structure.
• Proven track record of troubleshooting and solving structure and device related issues.

Responsibilities

• Lead process integration structural uniformity for critical modules.
• Develop and apply model-based root cause analysis frameworks.
• Own and advance product integration programs and loop-level domain expertise.
• Drive worldwide technical alignment and execution excellence.

Skills

5+ years’ experience in a process-related role

Semiconductor industry knowledge

Model-based problem solving

Data-driven decision making

Strong logical thinking

Good multitasking skills

Education

Bachelors/Masters/PhD. in EE, Materials Engineering, Materials Science, Physics and Chemistry

Job description

Uniformity Staff/Principal Engineer, Front End, Central Product Integration (FE cPIE)

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all.

What’s Encouraged Daily

• Lead process integration (PI) structural uniformity and cross-loop integration for critical modules (e.g., capacitance loop), owning end-to-end integration strategies to resolve yield, quality, and reliability gaps. Drive physics- and process-based integration solutions through close collaboration with cross-module process owners, PI subject-matter experts, and key suppliers to optimize integration structures and achieve BIC yield and quality targets.
• Develop and apply model-based root cause analysis frameworks (transport, reaction kinetics, pattern density, and geometry-dependent effects) to diagnose structural non-uniformity. Define, implement, and continuously strengthen critical inline monitoring and defense lines (CD, film loss, mass delta, defectivity, edge/periphery metrics) to ensure robust control of structural uniformity.
• Own and advance product integration programs and loop-level domain expertise, maintaining deep technical knowledge across node transitions. Proactively drive node-over-node “shift-left” integration, including early implementation of uniformity, bevel, and backside best-known-methods (BKMs) during development phases to accelerate whole-wafer (center-to-edge) yield and quality ramp.
• Drive worldwide technical alignment and execution excellence by leading global projects, standardizing and using network BKMs, and scaling proven solutions across sites. Identify efficiency and performance gaps, and lead business process creation, optimization, and reengineering to improve benchmark performance, cycle time, and development productivity.

How To Qualify

• 5+ years’ experience in a process-related role in the semiconductor industry.
• Bachelors/Masters/PhD. in EE, Materials Engineering, Materials Science, Physics and Chemistry.
• Be able to travel to Micron sites as vital for face-to-face teamwork.
• Strong logical thinking and knowledge of semiconductor fabrication process flows, the interaction of different processes, and how changes affect yield, device performance and reliability. Understanding of DRAM and NAND operation and structure to decipher parametric, probe and qualification data from both front end and back end assembly processes.
• Good model-based problem solving combined with data-driven decision making and presentation skills. Proven track record of troubleshooting and solving structure and device related issues, and addressing root cause.

What Sets You Apart

• Excellent organizational capabilities and ability to work effectively. Flexibility with job responsibilities and initiative to assume added responsibilities.
• Strong interpersonal skills and customer/co-worker relationships. Demonstrated teamwork with a focus on developing good team dynamics.
• Good multitasking, verbal and written communication skills.

Job Profile(s)

• FAB Engineer4 – FAB Engineer5

Relocation Level: TBD

Benefits

Micron provides a comprehensive benefits program including medical, dental, and vision coverage, income protection, paid family leave, paid time‑off, and paid holidays. For more information, please see the Benefits Guide on the Micron website.

EEO Statement

Micron is proud to be an equal opportunity workplace and is an affirmative action employer. All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, age, national origin, citizenship status, disability, protected veteran status, gender identity or any other factor protected by applicable federal, state, or local laws.