Field Service Engineer I – Precision Electronics

Mycronic Job Openings; United States; On-site; USD 75,000 - 90,000; Full time

Benefits offered by this job

Competitive base salary

Bonus program

Medical/dental/vision

Life and disability insurance

401(k) with 5% match

Tuition reimbursement

Paid holidays

Job summary

Mycronic is seeking a Service Engineer I to provide remote and on-site technical support across the US, Canada, and Mexico. You will repair, install, and optimize die bonding equipment, diagnose issues, and train customers on proper operation.

You will work within the Global Technologies division, collaborating with teams and traveling to customer sites as needed to ensure reliability and performance.

Qualifications

• Engineering degree required; assoc or bachelor preferred.
• 3–5 years of field service or repair experience on semiconductor back-end equipment.
• Strong analytical and problem-solving abilities; excellent communication.
• Willingness to travel across the US, Canada, and Mexico.

Responsibilities

• Perform equipment repairs, installations, and maintenance at customer facilities
• Install and implement hardware and software upgrades to support equipment performance and functionality
• Provide timely technical support to customers by phone and email
• Diagnose and troubleshoot equipment issues and communicate findings to the factory
• Deliver technical training to customers at their facilities

Skills

Communication skills

Analytical thinking

Travel willingness

Education

Engineering degree (assoc/bach)

Job description

Mycronic is seeking a Service Engineer I to provide remote and on-site technical support across the US, Canada, and Mexico. You will repair, install, and optimize die bonding equipment, diagnose issues, and train customers on proper operation.

You will work within the Global Technologies division, collaborating with teams and traveling to customer sites as needed to ensure reliability and performance.