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HPSP Co., LTD is seeking a Field Service Engineer to support installation and maintenance of semiconductor equipment at customer sites. You will manage 300mm high pressure annealing furnace systems, covering electronic, mechanical, vacuum, gas delivery, and factory automation subsystems.
The role requires a two-year technical degree in electronics or electromechanical fields, strong troubleshooting and communication skills, and willingness to travel up to 30%.
HPSP is a leading manufacturer of semiconductor capital equipment for the semiconductor industry. Come join our successful team and help contribute to achieving the next level of best-in-class support for our HPAP equipment technology.
Field Service Engineer will support semiconductor equipment installation and maintenance at customer site. This position will be responsible for installation, preventative and unscheduled maintenance, and day to day running of a 300mm high pressure annealing furnace system at customer facility. The positions duties entail maintaining the complete system including the following sub systems; electronic, electrical, electro-magnetic, mechanical, pneumatic, vacuum, heating systems, gas delivery, 300mm factory automation, and wafer transfer systems. Additional responsibilities include completing field service documentation, which is utilized for tracking system reliability and customer billing. Good customer interface and communication skills are necessary for this position.
Position will report to customers manufacturing facility daily. This will be a normally scheduled day shift, Monday through Friday work schedule. Compressed workweeks may apply, and willingness to work occasional overtime. Field engineers will report to a site coordinator who will provide direction and job duties.