Field Service Engineer — Semiconductors (On-Site, 30% Travel)

HPSP Co., LTD; Arizona; On-site; USD 70,000 - 100,000; Full time

Job summary

HPSP Co., LTD is seeking a Field Service Engineer to support installation and maintenance of semiconductor equipment at customer sites. You will manage 300mm high pressure annealing furnace systems, covering electronic, mechanical, vacuum, gas delivery, and factory automation subsystems.

The role requires a two-year technical degree in electronics or electromechanical fields, strong troubleshooting and communication skills, and willingness to travel up to 30%.

Qualifications

• Minimum two-year technical degree with emphasis in electronics or electromechanical devices or equivalent work experience.
• Effective troubleshooting, diagnostic, analytical, and problem-solving abilities.
• Knowledge of electronics, pneumatics, automation, electro-mechanical systems; robotics, software, workstations, and OS.
• Knowledge/experience with high pressure systems and/or furnaces is a plus.
• Effective communication, collaboration, teamwork, multi-tasking, and customer skills.
• Good business acumen.
• Good initiative and willingness to learn/grow.
• Personal responsibility for results and integrity.
• Integrity, professionalism, and customer centricity.
• Basic knowledge of tools and test equipment.

Responsibilities

• Perform preventative and unscheduled maintenance.
• On-site installation of complex equipment and testing procedures.
• Generate technical reports and attend meetings.
• Provide troubleshooting and repair support for customers and field staff.
• Travel to customer sites, often on short notice (30%).
• Provide training for customers and users on system maintenance.
• Provide input for system documentation and reports.

Skills

Troubleshooting

Diagnostic

Analytical

Problem-solving

Communication

Collaboration

Teamwork

Multi-tasking

Customer skills

Business acumen

Initiative

Integrity

Professionalism

Customer centricity

Education

Two-year technical degree in electronics or electromechanical devices

Tools

High pressure furnaces

Robotics

Automation systems

Workstations / Operating systems

Job description

HPSP Co., LTD is seeking a Field Service Engineer to support installation and maintenance of semiconductor equipment at customer sites. You will manage 300mm high pressure annealing furnace systems, covering electronic, mechanical, vacuum, gas delivery, and factory automation subsystems.

The role requires a two-year technical degree in electronics or electromechanical fields, strong troubleshooting and communication skills, and willingness to travel up to 30%.