Failure Analysis Technician – Chip Yield & FIB/SEM Expert

TSMC - Taiwan Semiconductor Manufacturing Company Limited; Phoenix (AZ); On-site; USD 55,000 - 85,000; Full time

Job summary

TSMC Arizona is seeking a Failure Analysis Technician for our 5-nanometer fab in Phoenix. You will contribute to chip failure analysis to reinforce process robustness, improve yield, and deliver reliable, high-quality wafers for world-changing products.

In this role you will operate FIB, SEM, C-AFM and nano-probe tools, assist TEM sample prep including site marking and de-layering, handle chemicals safely, collect data, report findings to engineers and support Fab manufacturing with on-call

Qualifications

• TEM sample preparation for semiconductor devices.
• Experience with HR-STEM imaging and EDS analysis preferred.
• Ability to work independently and meet deadlines.
• Willingness to work night and weekend shifts when assigned.

Responsibilities

• Operate FIB to prepare samples and report findings.
• TEM sample prep including site marking and de-layering.
• Handle chemicals safely with PPE.
• Collect data and report to engineers.
• Assist engineers with analytical method development.
• Maintain 6S lab housekeeping and protocols.
• Support Fab manufacturing and on-call schedule.

Skills

Team player

Strong work ethic

Independent worker

Shift flexibility

Analytical mindset

Education

Associate or Bachelor's in Science/Engineering/Technology

Tools

FIB

SEM

TEM

HR-STEM imaging

EDS analysis

6S/housekeeping

Job description

TSMC Arizona is seeking a Failure Analysis Technician for our 5-nanometer fab in Phoenix. You will contribute to chip failure analysis to reinforce process robustness, improve yield, and deliver reliable, high-quality wafers for world-changing products.

In this role you will operate FIB, SEM, C-AFM and nano-probe tools, assist TEM sample prep including site marking and de-layering, handle chemicals safely, collect data, report findings to engineers and support Fab manufacturing with on-call