Semiconductor Failure Analysis Technician (TEM/FIB)

TSMC; Austin (TX); On-site; USD 60,000 - 80,000; Full time

Job summary

TSMC Arizona is seeking a Failure Analysis Technician to join our 5-nanometer fab in Phoenix. You will perform chip failure analysis using FIB, SEM, C-AFM and nano-probe tools, with responsibilities including data collection and reporting to engineers.

The role requires TEM sample prep, site marking, de-layering, safe chemical handling, and the ability to work nights or weekends when needed, in a clean room environment.

Qualifications

• TEM sample preparation for semiconductor devices in advanced process nodes.
• HR-STEM imaging and EDS analysis experience preferred.
• Basic PC skills (MS Windows OS and MS Office).

Responsibilities

• Operating FIB to prepare PFA samples, SEM, C-AFM and nano-probe tool for analysis and reporting.
• TEM sample preparation will include site marking, de-layering, and other necessary steps.
• Chemicals handling in a safe manner with PPE is required.
• Collecting and organizing data, and reporting to engineers.
• Assisting engineers with analytical method development.
• Maintaining laboratory housekeeping (6S) environment and protocols.
• Supporting Fab manufacturing operations and being part of our teams’ on-call schedule.

Skills

Independent worker

Team player

Night/weekend shifts

Work under pressure

Data reporting

Education

Associate or Bachelors in Science/Engineering/Technology

Tools

MS Windows OS

MS Office

Job description

TSMC Arizona is seeking a Failure Analysis Technician to join our 5-nanometer fab in Phoenix. You will perform chip failure analysis using FIB, SEM, C-AFM and nano-probe tools, with responsibilities including data collection and reporting to engineers.

The role requires TEM sample prep, site marking, de-layering, safe chemical handling, and the ability to work nights or weekends when needed, in a clean room environment.