Failure Analysis Technician F21

TSMC; Phoenix (AZ); On-site; USD 50,000 - 70,000; Full time

Job summary

TSMC Arizona is seeking a Failure Analysis Technician in Phoenix to perform chip failure analysis and support fab operations.

Responsibilities include operating FIB, SEM, C-AFM and nano-probe tools, TEM sample preparation, data reporting and collaboration with engineers. The role requires flexibility for night/weekend shifts and potential clean room work.

Qualifications

• Associate degree or higher; science/engineering/tech focus preferred.
• Experience with TEM sample preparation in semiconductor devices helpful.
• Experience with HR-STEM imaging and EDS analysis preferred.
• Ability to work independently and meet deadlines.
• Team player with a positive attitude and strong work ethic.
• Be able to work night and weekend shifts and overtime if needed.

Responsibilities

• Operate FIB to prepare PFA samples, SEM, C-AFM and nano-probe tool for analysis and reporting.
• TEM sample prep including site marking, de-layering and other steps.
• Handle chemicals safely with PPE.
• Collect and organize data, report to engineers.
• Assist engineers with analytical method development.
• Maintain 6S housekeeping environment and protocols.
• Support Fab manufacturing operations and be on-call when scheduled.

Skills

TEM sample prep

HR-STEM imaging

EDS analysis

Data reporting

6S housekeeping

PPE safety handling

Education

Associate degree (A.A.S.) or Bachelors degree in Science/Engineering/Technology

Tools

MS Windows OS

MS Office

Job description

Failure Analysis Technician

At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. As long as you have the same passion to pursue excellence, you will find your fit here.

TSMC Arizona is looking for a Failure Analysis Technician to join our 5-nanometer fab, located in sunny Phoenix, Arizona. As a Failure Analysis Technician, you will demonstrate a strong sense of chip failure analysis and possess an attitude that embodies our core values - Integrity, Commitment, Innovation and Customer Trust.

TSMC Arizona’s Product Failure Analysis is responsible for chip failure analysis to reinforce our process robustness and ensure high yield and quality of the wafers.

Job Description

Your main responsibilities include:

• Operating FIB to prepare PFA samples, SEM, C-AFM and nano-probe tool for analysis and reporting
• TEM sample preparation will also include sample pre-treatment such as site marking, de-layering, and other necessary steps.
• Chemicals handling in a safe manner with PPE is required.
• Collecting and organizing data, and reporting to engineers
• Assisting engineers with analytical method development.
• Maintaining laboratory housekeeping (6S) environment and protocols.
• Supporting Fab manufacturing operations and being part of our teams’ on-call schedule.

Minimum Qualifications

Applicants must be legally eligible to work in the United States and have:

• Associate degree (A.A.S.) or Bachelors degree at a Science/Engineering/Technology school or the equivalent education is preferred but not required.
• Experience in TEM sample preparation for semiconductor devices in advanced process nodes.
• TEM analysis experience/skill in HR-STEM imaging and EDS analysis is preferred but not required.
• Able to work independently and prioritize your tasks on-hand to meet deadlines.
• Must be a team player and have a positive attitude and strong work ethic.
• Be able to handle pressure in a fast-paced working environment.
• Be able to work night and weekend shifts when assigned, and work overtime if needed.
• May be required to work in a clean room environment (Near-line FIB/TEM).
• Basic PC skills (MS Windows OS and MS Office) are required.

Work Location: Phoenix, AZ

Training Location: Phoenix, AZ

Travel: 0%