Failure Analysis Technician F21

TSMC - Taiwan Semiconductor Manufacturing Company Limited; Phoenix (AZ); On-site; USD 55,000 - 85,000; Full time

Job summary

TSMC Arizona is seeking a Failure Analysis Technician for our 5-nanometer fab in Phoenix. You will contribute to chip failure analysis to reinforce process robustness, improve yield, and deliver reliable, high-quality wafers for world-changing products.

In this role you will operate FIB, SEM, C-AFM and nano-probe tools, assist TEM sample prep including site marking and de-layering, handle chemicals safely, collect data, report findings to engineers and support Fab manufacturing with on-call

Qualifications

• TEM sample preparation for semiconductor devices.
• Experience with HR-STEM imaging and EDS analysis preferred.
• Ability to work independently and meet deadlines.
• Willingness to work night and weekend shifts when assigned.

Responsibilities

• Operate FIB to prepare samples and report findings.
• TEM sample prep including site marking and de-layering.
• Handle chemicals safely with PPE.
• Collect data and report to engineers.
• Assist engineers with analytical method development.
• Maintain 6S lab housekeeping and protocols.
• Support Fab manufacturing and on-call schedule.

Skills

Team player

Strong work ethic

Independent worker

Shift flexibility

Analytical mindset

Education

Associate or Bachelor's in Science/Engineering/Technology

Tools

FIB

SEM

TEM

HR-STEM imaging

EDS analysis

6S/housekeeping

Job description

At TSMC Arizona, brilliance can ignite a world of innovation and launch a promising future. The world’s most brilliant innovators entrust us to transform their ideas into world-changing products that impact millions of lives. As long as you have the same passion to pursue excellence, you will find your fit here.

TSMC Arizona is looking for a Failure Analysis Technician to join our 5-nanometer fab, located in sunny Phoenix, Arizona. As a Failure Analysis Technician, you will demonstrate a strong sense of chip failure analysis and possess an attitude that embodies our core values – Integrity, Commitment, Innovation and Customer Trust.

TSMC Arizona’s Product Failure Analysis is responsible for chip failure analysis to reinforce our process robustness and ensure high yield and quality of the wafers.

Job Description:

Your main responsibilities include:

• Operating FIB to prepare PFA samples, SEM, C-AFM and nano-probe tool for analysis and reporting
• TEM sample preparation will also include sample pre-treatment such as site marking, de-layering, and other necessary steps.
• Chemicals handling in a safe manner with PPE is required.
• Collecting and organizing data, and reporting to engineers
• Assisting engineers with analytical method development.
• Maintaining laboratory housekeeping (6S) environment and protocols.
• Supporting Fab manufacturing operations and being part of our teams’ on-call schedule.

Minimum Qualifications:

Applicants must be legally eligible to work in the United States and have:

• Associate degree (A.A.S.) or Bachelors degree at a Science/Engineering/Technology school or the equivalent education is preferred but not required.
• Experience in TEM sample preparation for semiconductor devices in advanced process nodes (<28nm) is preferred but not required.
• TEM analysis experience/skill in HR-STEM imaging and EDS analysis is preferred but not required.
• Able to work independently and prioritize your tasks on-hand to meet deadlines.
• Must be a team player and have a positive attitude and strong work ethic.
• Be able to handle pressure in a fast-paced working environment.
• Be able to work night and weekend shifts when assigned, and work overtime if needed.
• May be required to work in a clean room environment (Near-line FIB/TEM).
• Basic PC skills (MS Windows OS and MS Office) are required.