Equipment Engineer: Deposition & Thermal Processes

University of Texas at Austin; Austin (TX); On-site; USD 90,000 - 120,000; Full time

Benefits offered by this job

Employer-paid medical coverage

Retirement contributions

Paid vacation and sick time

Paid holidays

Job summary

University of Texas at Austin seeks an Equipment Engineer for Deposition and Thermal Process Development at the Microelectronics Research Center. The role ensures deposition and thermal equipment operate baselined and supports integration with lithography and etch areas.

Responsibilities include maintaining sputtering, evaporation, ALD, CVD, and furnaces, optimizing process parameters, and collaborating with researchers to advance thin-film deposition and metrology.

Qualifications

• Bachelor's degree in EE/Mech/Materials/Physics or related field.
• Minimum 3 years of experience with semiconductor or thin-film deposition equipment.
• Strong understanding of vacuum systems, gas delivery, thermal processes, and deposition techniques.
• Experience with equipment diagnostics, troubleshooting, and component-level repair.

Responsibilities

• Own and maintain deposition toolsets (sputtering, evaporation, ALD, CVD, furnaces) to meet uptime, reliability, and performance targets.
• Monitor, control, and optimize pressure, gas flow, temperature uniformity, and deposition rate.
• Perform tool qualification, calibration, and matching for repeatable film deposition.

Skills

Vacuum systems

Thin-film deposition

Diagnostics

Troubleshooting

Safety compliance

Education

Bachelor's degree in Electrical/Mechanical/Materials Science/Physics or related field

Master's degree preferred

Tools

Python scripting

Scripting/Data analysis tools

Job description

University of Texas at Austin seeks an Equipment Engineer for Deposition and Thermal Process Development at the Microelectronics Research Center. The role ensures deposition and thermal equipment operate baselined and supports integration with lithography and etch areas.

Responsibilities include maintaining sputtering, evaporation, ALD, CVD, and furnaces, optimizing process parameters, and collaborating with researchers to advance thin-film deposition and metrology.