Senior Process Engineer - Deposition

Atomica; Goleta (CA); On-site; USD 120,000 - 145,000; Full time

Job summary

Atomica is searching for a driven Process Engineer to join the Surface Engineering team in Goleta, California. This position focuses on deposition processes, collaborating closely with multiple disciplines to enhance product quality and manufacturability. Candidates must have a strong background in semiconductor microfabrication and be proficient in data analysis and hardware troubleshooting. The base compensation is competitive, ranging from $120,000 to $145,000 per year.

Qualifications

• 5+ years in a semiconductor microfabrication manufacturing environment.
• Expert-level proficiency in JMP for data analysis, statistical modeling, and DOE.
• Hands-on hardware troubleshooting with the ability to diagnose mechanical, electrical, and vacuum-related failures.

Responsibilities

• Design and execute recipes for new thin-film applications.
• Lead the technical evaluation, installation, and testing of new capital equipment.
• Design and execute Design of Experiments (DOE) to determine process windows.
• Act as the primary technical expert for resolving complex process-hardware interactions.
• Implement and monitor Statistical Process Control charts.

Skills

Process Optimization

Data Analysis

Troubleshooting

Vacuum Systems Handling

Education

B.S., M.S., or Ph.D. in Materials Science, Electrical Engineering, Physics, or other engineering discipline

Tools

JMP

Thin-Film Equipment

Job description

Overview

Atomicais seeking a driven Process Engineer to join our Surface Engineering team, with a primary focus on deposition. We are looking for someone who can support existing production processes and develop processes for new programs (20+) focusing on product quality and manufacturability. Collaboration is essential as you work closely with the integration, manufacturing engineering, maintenance, and production teams on the development of new processes, selection of new equipment/technology, standardization, and problem resolution. This role is designed for a technical leader who thrives at the intersection of advanced materials and complex vacuum hardware.

Responsibilities

• New Process & Tool Development
• End-to-End Development: Design and execute recipes for new thin-film applications, ensuring adherence to required material properties (mechanical, optical, and electrical).
• Integration Collaboration: Partner with the integration team to ensure surface engineering solutions meet functional requirements for complex devices.
• Tool Qualification: Lead the technical evaluation, installation, and testing of new capital equipment to meet production-ready standards.
• DOE & Optimization: Design and execute Design of Experiments (DOE) to determine process windows and optimize results. Strong fundamentals in data analysis and critical thinking.
• Advanced Troubleshooting & Root Cause Analysis
• Early-Stage & Production Support: Identify and resolve fundamental process instabilities during early-stage R&D while leading Task Force efforts for chronic production excursions.
• Hardware-Process Mastery: Act as the primary technical expert for resolving complex process-hardware interactions.
• Tool Troubleshooting: Diagnostics on vacuum systems, RF power delivery, and gas flow controllers; hands-on experience is highly valued.
• Sustaining & Standardization
• Statistical Process Control (SPC): Implement and monitor SPC charts in JMP to identify trends, prevent excursions, and ensure long-term process stability.
• Standardization: Author and maintain high-quality Standard Operating Procedures and technical documentation for cross-shift consistency.

Technical Expertise Preferred

• Deposition (Primary Focus)
  PVD: RF, DC, and Pulsed DC Magnetron Sputtering, Ion Beam Deposition (IBD), and E-beam evaporation
• CVD & ALD: PECVD, HDPCVD, ALD, and LPCVD
• Thermal: Oxidation furnaces, annealing, and RTP/RTA

Dry Etch & Clean

• Plasma Processing: Bosch process (DRIE), dielectric etching, plasma ashing, and Ion Beam Etching (IBE)

Required Qualifications

• B.S., M.S., or Ph.D. in Materials Science, Electrical Engineering, Physics, or other engineering discipline.
• 5+ years in a semiconductor microfabrication manufacturing environment.
• Deep understanding of material properties and the specific process knobs required to obtain them.
• Expert-level proficiency in JMP for data analysis, statistical modeling, and DOE.
• Hands-on hardware troubleshooting with the ability to diagnose mechanical, electrical, and vacuum-related failures.

Compensation

The base pay range for this role is $120,000 – $145,000 per year.