Senior Process Engineer - Deposition

Atomica Corporation

Goleta (CA)

On-site

USD 95,000 - 125,000

Full time

14 days+

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Job summary

Atomica Corporation is seeking a driven Process Engineer to join our Surface Engineering team in Goleta, California. This role emphasizes collaboration and technical leadership, focusing on the development of new processes for thin-film applications and the troubleshooting of production challenges. Candidates should possess strong skills in materials science and electrical engineering with expertise in statistical process control and hardware diagnostics. Join us in creating advanced materials solutions!

Qualifications

  • 5+ years of experience in a semiconductor microfabrication manufacturing environment.
  • Deep understanding of material properties and processes.
  • Expert-level proficiency in JMP for data analysis and statistical modeling.

Responsibilities

  • Design and execute recipes for new thin-film applications.
  • Partner with integration teams to ensure functional requirements.
  • Lead evaluation and testing of new capital equipment.

Skills

Hands-on hardware troubleshooting
Statistical Process Control (SPC)
Data analysis and critical thinking

Education

B.S., M.S., or Ph.D. in Materials Science, Electrical Engineering, Physics

Tools

JMP
Vacuum systems

Job description

Summary

Atomicais seeking adrivenProcess Engineerto join ourSurface Engineering, with a primary focusondeposition. We are looking for someone who cansupportexistingproduction processesand develop processes fornewprograms(20+)focusingonproductqualityand manufacturability. Collaboration isa mustas you work closely with the integration, manufacturing engineering, maintenanceand production teams on development of new processes, selectionof new equipment/technology, standardizationand problem resolution. This role is designed for a technical leader who thrives at the intersection of advanced materialsand complex vacuum hardware.

Primary Responsibilities
1. New Process & Tool Development
  • End-to-End Development: Design and execute recipes for new thin-film applications, ensuring strict adherence to required material properties (mechanical, optical and electrical characteristics).
  • Integration Collaboration: Partner with the integration team to ensure surface engineering solutions meet functional requirements for complex devices.
  • Tool Qualification: Lead the technical evaluation, installation, and testing of new capital equipment to meet production-ready standards.
  • DOE & Optimization: Design and execute Design of Experiments (DOE) to determine process windows and optimize results. Strong fundamentals in data analysis and demonstrated critical thinking skills.
2. Advanced Troubleshooting & Root Cause Analysis
  • Early-Stage & Production Support: Identify and resolve fundamental process instabilities during early-stage R&D while maintaining the discipline to lead "Task Force" efforts for chronic production excursions.
  • Hardware-Process Mastery: Act as the primary technical expert for resolving complex process‑hardware interactions.
  • Tool Troubleshooting: Help perform diagnostics on vacuum systems, RF power delivery, and gas flow controllers. Hands‑on experience is highly valued.
3. Sustaining & Standardization
  • Statistical Process Control (SPC): Implement and monitor SPC charts in JMP to identify trends, prevent excursions, and ensure long‑term process stability.
  • Standardization: Author and maintain high‑quality Standard Operating Procedures and technical documentation to ensure cross‑shift consistency.
Technical ExpertisePreferred
Deposition (Primary Focus)
  • PVD: Experience with RF, DC, and Pulsed DC Magnetron Sputtering, Ion Beam Deposition (IBD) and E‑beam evaporation.
  • CVD & ALD: Deep knowledge of PECVD, HDPCVD, ALD, and LPCVD.
  • Thermal: Proficiency in oxidation furnaces, annealing, and RTP/RTA.
Dry Etch & Clean
  • Plasma Processing: Hands‑on experience with Bosch process (DRIE), dielectric etching, plasmaashing, and Ion Beam Etching (IBE).
Required Qualifications
  • B.S., M.S., or Ph.D. in Materials Science, Electrical Engineering, Physics, or other engineering discipline.
  • 5+ years of experience in a semiconductor microfabrication manufacturing environment.
  • Deep understanding of material properties and the specific process knobs required to obtain them.
  • Expert‑level proficiency in JMP for data analysis, statistical modeling, and DOE.
  • Proven track record of "hands‑on" hardware troubleshooting. Ability to diagnose mechanical, electrical, and vacuum‑related failures.
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