Equipment Engineer, Deposition and Thermal Process Development, Microelectronics Research Center

University of Texas; Austin (TX); On-site; USD 81,000 - 99,000; Full time

Benefits offered by this job

100% employer-paid basic medical care

Retirement contributions

Paid vacation and sick time

Paid holidays

Job summary

University of Texas at Austin seeks an Equipment Engineer in Deposition and Thermal Process Development to ensure deposition and thermal tools are operational and baselined. The role collaborates with lithography and etch to enable integrated process development.

You will support metrology, data collection, and process integration while maintaining safety and documentation in a busy research environment in Austin, Texas.

Qualifications

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or related field.
• Minimum 3 years of experience with semiconductor or thin‑film deposition equipment.
• Strong vacuum, gas delivery, and thermal processing knowledge.
• Diagnostics, troubleshooting, and component‑level repair experience.
• Electrical film characterization experience (4‑point probe, Hall, probe station).
• Familiarity with cleanroom operations and microfabrication workflows.
• Experience with metrology and film characterization techniques.

Responsibilities

• Own and maintain deposition toolsets (sputtering, evaporation, ALD, CVD, furnaces) to meet uptime, reliability, and performance targets.
• Perform diagnostics, root-cause analysis, and hands‑on repair of equipment and components.
• Develop and optimize thin‑film deposition processes in collaboration with researchers.
• Utilize metrology tools to characterize films and correlate with equipment performance.
• Collaborate with researchers to ensure tool performance meets lithography requirements.
• Train users, develop SOPs, and maintain maintenance documentation.
• Ensure safety, compliance, and cleanroom protocols are followed.

Skills

Semiconductor deposition

Thin-film deposition

Vacuum systems

Diagnostics & troubleshooting

Electrical characterization

Metrology & characterization tools

Cleanroom workflows

Python scripting

Education

Bachelor’s degree in EE/ME/Materials/Physics

Master’s degree (preferred)

Tools

Ellipsometry

SEM

AFM

XRR

Job description

Equipment Engineer, Deposition and Thermal Process Development, Microelectronics Research Center

Hiring Department: Office of the Vice President for Research

Position Open To: All Applicants

Weekly Scheduled Hours: 40

FLSA Status: Exempt from FLSA

Earliest Start Date: Immediately

Position Duration: Expected to Continue

Location: AUSTIN, TX

UT Austin offers a competitive benefits package that includes:

• 100% employer-paid basic medical coverage
• Retirement contributions
• Paid vacation and sick time
• Paid holidays

Purpose

This position will be responsible for ensuring processes and the equipment in the areas of deposition and thermal process are operational and baselined as well as providing support for process integration with lithography and etch areas.

Responsibilities

• Equipment Performance, Maintenance, and Sustainment Own and maintain deposition toolsets (sputtering, evaporation, ALD, CVD, furnaces) to meet uptime, reliability, and performance targets. Monitor and optimize key system parameters such as pressure control, gas flow, temperature uniformity, plasma stability (for sputtering), and deposition rate control. Perform tool qualification, calibration, and matching to ensure repeatable film deposition across systems.
• Diagnostics, Troubleshooting, and Repair Perform advanced diagnostics and root cause analysis for equipment-related issues affecting film quality and system performance. Conduct hands‑on troubleshooting and repair, including replacement of electronic boards, sensors, power supplies, vacuum components, and mechanical assemblies. Coordinate with vendors on major repairs, upgrades, and preventative maintenance strategies.
• Process Development Support Support development and optimization of thin-film deposition processes in collaboration with engineers and researchers. Establish baseline recipes and process windows for metals, dielectrics, and functional materials. Ensure equipment capability aligns with lithography-defined requirements such as feature size, step coverage, and pattern transfer.
• Metrology and Characterization Integration Utilize and support metrology tools (e.g., ellipsometry, profilometry, SEM, AFM, XRR) to characterize film thickness, uniformity, stress, adhesion, and morphology. Correlate metrology data with equipment performance to identify drift, non-uniformity, or failure modes. Maintain a set of electrical characterization systems to support monitoring of electrical quality of films and contacts. Support data collection, analysis, and process monitoring using scripting tools where applicable.
• Collaboration and Integration Work closely with researchers, engineers and technicians to align tool performance with process requirements. Support downstream integration by ensuring lithography tools meet performance needs for etching, deposition, and lift‑off processes. Participate in facility planning related to tool upgrades, replacements, and capability expansion. Collaborate with other process engineers, technicians, and researchers to support process transfer, yield improvement, and multi‑step process integration. Participate in interdisciplinary projects involving lithography, metrology, etching, and deposition.
• User Support, Training, and Documentation Train users on equipment operation, capabilities, limitations, and safety practices. Develop and maintain standard operating procedures (SOPs), training materials, and maintenance documentation. Provide technical support to researchers for process planning and tool selection.
• Safety and Compliance Ensure safe operation of deposition systems, including vacuum systems, high‑voltage components, and process gases. Maintain compliance with institutional safety standards and cleanroom protocols. Participate in safety reviews, hazard assessments, and incident response as required.

Required Qualifications

• Bachelor’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or related field.
• Minimum 3 years of experience with semiconductor or thin‑film deposition equipment.
• Strong understanding of vacuum systems, gas delivery systems, thermal processes, physical and plasma-based deposition techniques.
• Demonstrated experience with equipment diagnostics, troubleshooting, and component‑level repair (electronics and mechanical systems).
• Experience with thin‑film characterization and metrology techniques (e.g., ellipsometry, SEM, AFM).
• Experience with electrical characterization of films and devices (e.g., 4‑point probe, Hall, probe station).
• Familiarity with cleanroom operations and microfabrication workflows.
• Relevant education and experience may be substituted as appropriate.

Preferred Qualifications

• Master’s degree in Electrical Engineering, Mechanical Engineering, Materials Science, Physics, or related field.
• Experience supporting sputtering, evaporation (thermal/e‑beam), ALD, furnaces, Rapid Thermal Process, and CVD systems in a research or pilot‑line environment.
• Familiarity with lithography processes and pattern‑dependent deposition (e.g., lift‑off, step coverage challenges).
• Experience with scripting or data analysis tools (e.g., Python) for equipment monitoring or process correlation.
• Experience in a shared‑user academic or national laboratory cleanroom.
• Knowledge of film stress engineering, adhesion layers, and interface control.

Working Conditions

• Uniforms and/or personal protection equipment (furnished)
• May work in all weather conditions
• May work in extreme temperatures
• May work around chemical fumes
• May work around standard office conditions
• May work around biohazards
• May work around chemicals
• May work around electrical and mechanical hazards
• Repetitive use of a keyboard at a workstation
• Use of manual dexterity
• Climbing of stairs
• Climbing of ladders
• Lifting and moving
• Occasional weekend, overtime and evening work to meet deadlines

Required Materials

• Resume/CV 3 work references with their contact information; at least one reference should be from a supervisor.
• Letter of interest

Salary Range $90,000 + depending on qualifications

Employment Eligibility: Regular staff who have been employed in their current position for the last six continuous months are eligible for openings being recruited for through University‑Wide or Open Recruiting, to include both promotional opportunities and lateral transfers. Staff who are promotion/transfer eligible may apply for positions without supervisor approval.

Retirement Plan Eligibility: The retirement plan for this position is Teacher Retirement System of Texas (TRS), subject to the position being at least 20 hours per week and at least 135 days in length. This position has the option to elect the Optional Retirement Program (ORP) instead of TRS, subject to the position being 40 hours per week and at least 135 days in length.

Background Checks: A criminal history background check will be required for finalist(s) under consideration for this position.

Equal Opportunity Employer: The University of Texas at Austin, as an equal opportunity/affirmative action employer, complies with all applicable federal and state laws regarding nondiscrimination and affirmative action. The University is committed to a policy of equal opportunity for all persons and does not discriminate on the basis of race, color, national origin, age, marital status, sex, sexual orientation, gender identity, gender expression, disability, religion, or veteran status in employment, educational programs and activities, and admissions.

Pay Transparency: The University of Texas at Austin will not discharge or in any other manner discriminate against employees or applicants because they have inquired about, discussed, or disclosed their own pay or the pay of another employee or applicant. However, employees who have access to the compensation information of other employees or applicants as a part of their essential job functions cannot disclose the pay of other employees or applicants to individuals who do not otherwise have access to compensation information, unless the disclosure is (a) in response to a formal complaint or charge, (b) in furtherance of an investigation, proceeding, hearing, or action, including an investigation conducted by the employer, or (c) consistent with the contractor’s legal duty to furnish information.

Employment Eligibility Verification: If hired, you will be required to complete the federal Employment Eligibility Verification I-9 form. You will be required to present acceptable and original documents to prove your identity and authorization to work in the United States. Documents need to be presented no later than the third day of employment. Failure to do so will result in loss of employment at the university.

E-Verify: The University of Texas at Austin use E-Verify to check the work authorization of all new hires effective May 2015. The university’s company ID number for purposes of E-Verify is 854197. For more information about E-Verify, please see the following: E-Verify Poster (English and Spanish) [PDF] Right to Work Poster (English) [PDF] Right to Work Poster (Spanish) [PDF]

Compliance: Employees may be required to report violations of law under Title IX and the Jeanne Clery Disclosure of Campus Security Policy and Crime Statistics Act (Clery Act) and if this position is identified a Campus Security Authority (Clery Act), you will be notified and provided resources for reporting. Responsible employees under Title IX are defined and outlined in HOP-3031. The Clery Act requires all prospective employees be notified of the availability of the Annual Security and Fire Safety report. You may access the most recent report here or obtain a copy at University Compliance Services, 1616 Guadalupe Street, UTA 2.206, Austin, Texas 78701.

UT Austin is a Tobacco‑free Campus.