Entry-Level Lithography Module Engineer (Foundry)

Intel

Hillsboro (OR)

Hybrid

USD 134,000 - 189,000

Full time

2 days ago
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Job summary

Intel in Oregon's Hillsboro campus is seeking an entry-level Lithography TD Engineer to join the TD Lithography Module team. This role focuses on developing and executing manufacturing processes for advanced devices, with emphasis on quality, safety, and cross-functional collaboration.

You will design experiments, analyze data, and contribute to IP development with partners, while supporting transfer of technology across Intel sites.

Qualifications

  • Ph.D. or near completion in a relevant science or engineering field.
  • 2+ years of hands-on experimental research experience.
  • Desire to contribute to development of novel processes and IP.

Responsibilities

  • Design and execute experiments to develop manufacturing processes that meet specifications and safety requirements.
  • Analyze data and correlate process parameters with device yield.
  • Collaborate with partners to develop novel process flows and IP.
  • Install and qualify manufacturing capacity at TD site during ramp to high-volume manufacturing.
  • Support transfer of technology across Intel sites.

Skills

Hands‑on experimental research
Instrumentation design
Python/ML frameworks
Scientific problem-solving

Education

Ph.D. in Chemistry, Physics, Materials Science & Engineering, Chemical Engineering, Electrical Engineering, Mechanical Engineering, Nuclear Engineering, or related discipline
PhD candidate or completion within 12 months

Tools

Vacuum/optical systems
Instrumentation design

Job description

Intel in Oregon's Hillsboro campus is seeking an entry-level Lithography TD Engineer to join the TD Lithography Module team. This role focuses on developing and executing manufacturing processes for advanced devices, with emphasis on quality, safety, and cross-functional collaboration.

You will design experiments, analyze data, and contribute to IP development with partners, while supporting transfer of technology across Intel sites.

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