Dry Etch Module Development Engineer - Patterning

Intel Corporation; Hillsboro (OR); Hybrid; USD 134,000 - 255,000; Full time

Benefits offered by this job

Stock bonuses

Health benefits

Hybrid work model

Job summary

Intel Corporation in Hillsboro, Oregon, seeks a seasoned engineer to drive next-generation dry etch patterning for high-volume manufacturing. You will own process development, run DOE studies, and partner with Process Integration, Manufacturing, and Equipment teams to deliver robust, scalable solutions.

The role requires hands-on expertise with plasma etch, defect analysis, and statistical methods; you will mentor peers and help shape the technology roadmap for leading logic devices.

Qualifications

• PhD or Master's with relevant industry or research experience.
• Hands-on experience in dry etch semiconductor manufacturing.
• Experience with plasma etch fundamentals and defect mechanisms.
• Experience delivering dry etch process solutions that improve yield or reliability.
• Expertise in statistical analysis and DOE methodologies.

Responsibilities

• Drive technology development for future technology and high-volume manufacturing.
• Own and drive development of next generation patterning processes and roadmaps.
• Design and execute comprehensive characterization plans and experiments.
• Establish control systems to optimize production performance and sustainment.
• Mentor engineers and communicate status/risks to stakeholders.

Skills

Strong collaboration

Problem-solving

Technical communication

DOE methodologies

Statistical analysis

Education

PhD in Chemical Engineering / Materials Science / Physics / Electrical Engineering or related field

Master's degree with 2+ years relevant experience

Bachelor's degree with 4+ years industry experience

Tools

JMP

Python

MATLAB

Job description

Intel Corporation in Hillsboro, Oregon, seeks a seasoned engineer to drive next-generation dry etch patterning for high-volume manufacturing. You will own process development, run DOE studies, and partner with Process Integration, Manufacturing, and Equipment teams to deliver robust, scalable solutions.

The role requires hands-on expertise with plasma etch, defect analysis, and statistical methods; you will mentor peers and help shape the technology roadmap for leading logic devices.