EMIB-T Yield Lead — Advanced Packaging Excellence
Intel Corporation
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Benefits offered by this job
Job summary
Intel Corporation in the United States (Arizona, Phoenix) seeks an EMIB‑T Substrate Yield Lead to drive end-to-end substrate yield performance for EMIB‑T technology development and manufacturing readiness. The role requires proactive issue resolution and cross‑functional influence across IFS and IPG to meet program milestones.
The candidate should bring Masters or PhD with substantial experience, strong data analytics, and hands-on yield engineering expertise.
Qualifications
- Masters or PhD with relevant technical discipline.
- 5+ years in semiconductor manufacturing or advanced packaging.
- Hands-on experience in substrate/yield engineering and data analytics.
- Strong analytical skills and data-driven decision making.
- Experience influencing cross-organizational stakeholders.
Responsibilities
- Own end-to-end substrate yield performance for EMIB‑T.
- Lead DFM/DFY engagement and yield improvement plans.
- Run daily yield huddles and cross-functional reviews.
- Identify and close yield, reliability, process, and supplier issues.
- Collaborate with suppliers, engineers, and QA teams to hit milestones.
- Establish accountability and track actions to closure.
- Develop yield intelligence infrastructure and dashboards.
- Enable EMIB‑T deployment across multiple products.
Skills
Education
Tools
Job description
Intel Corporation in the United States (Arizona, Phoenix) seeks an EMIB‑T Substrate Yield Lead to drive end-to-end substrate yield performance for EMIB‑T technology development and manufacturing readiness. The role requires proactive issue resolution and cross‑functional influence across IFS and IPG to meet program milestones.
The candidate should bring Masters or PhD with substantial experience, strong data analytics, and hands-on yield engineering expertise.
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