Device Integration Engineer: Lead Process Innovation&Yield

Intel

Phoenix (AZ)

On-site

USD 103,730 - 198,820

Full time

14 days+

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Benefits offered by this job

Stock bonuses

Health benefits

Retirement plan

Vacation

Job summary

Intel is seeking an Experienced Hire for a process/yield-focused role in Phoenix, AZ. The role emphasizes semiconductor fabrication knowledge, DOE, data analysis, and leadership across engineering teams.

The candidate will drive process improvements, collaborate with multiple teams, and report progress to senior leadership. This position requires on-site work in the United States with a competitive compensation package.

Qualifications

Master’s degree in EE, Physics, Materials or related STEM field with 3+ years in semiconductors.
PhD in EE, Physics, Materials or related STEM field.
Experience in semiconductor process integration, yield or technology development.
Strong understanding of FEOL/BEOL manufacturing processes.
DOE design of experiments and process improvement in production.
Statistical methods: DOE, SPC, Cp/Cpk and root-cause analyses.
Experience supporting technology qualification, ramp and high-volume production.
Ability to lead complex technical projects across engineering disciplines.

Responsibilities

Drive the factory to meet specifications for transistor and discrete devices.
Collaborate with Module, Integration and Yield engineers to modify processes for quality and cost goals.
Control end-of-line quality metrics and perform root-cause analyses of device performance.
Improve quality, reliability, cost and yield through data-driven feedback to teams.
Summarize complex problems and communicate timelines and needs to senior leaders.
Engage with product, assembly test, and tech development engineers to implement improvements.