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Intel NM DMO Yield Department seeks engineers to support interconnect and advanced packaging semiconductor fabrication across Fab 11X and Fab 9, including Foveros, EMIB, Die Prep, and Wafer Level Assembly. You will lead experiments, data analysis, and cross-organizational initiatives to optimize processes and yield while improving cost and manufacturability.
Requires problem-solving skills, strong data analysis, and experience in process control.
Intel NM DMO Yield Department seeks engineers to support interconnect and advanced packaging semiconductor fabrication across Fab 11X and Fab 9, including Foveros, EMIB, Die Prep, and Wafer Level Assembly. You will lead experiments, data analysis, and cross-organizational initiatives to optimize processes and yield while improving cost and manufacturability.
Requires problem-solving skills, strong data analysis, and experience in process control.