Semiconductor Package Design Engineer

Micross Logo; Florida; Vor Ort; USD 140.000 - 190.000; Vollzeit

Benefits dieser Stelle

Medical, HSA, and FSA plans

Dental and vision insurance

401k with employer match

Generous tuition assistance

Zusammenfassung

A leading semiconductor solutions company in New York is seeking a packaging design engineer. The role requires 8-10 years of experience in semiconductor packaging design, strong expertise in Cadence APD+, and collaboration with design teams. A competitive benefits package, including health insurance and tuition assistance, is offered. This position demands excellent problem-solving skills and the ability to work effectively in a cross-functional team environment.

Qualifikationen

• 8 to 10 years of experience in semiconductor packaging design, modeling, and simulations.
• Strong authority on Cadence Allegro Package Designer Plus (APD+).
• Experience with design teams on floor plan, bump, and layout optimization.
• Experience on interposer and substrate layouts and design in advanced package technologies.
• Experience with 2.5D, 3D package design.
• Experience with design teams on floor plan, bump and layout optimization.
• Excellent problem solving, written and verbal communication, organization skills, and highly self-motivated.
• Record of success in cross-functional team environment.
• Good experience with SI/PI tools for package level extraction/simulation.

Aufgaben

• Design advanced semiconductor packages including layout and optimization.
• Collaborate with IC design teams to define package requirements.
• Conduct PI/SI analysis and documentation.
• Optimize die floorplan and bump patterns.
• Define IC package requirements with design teams.
• Document and release designs in archival systems.

Kenntnisse

Cadence Allegro Package Designer Plus (APD+)

Signal Integrity (SI) analysis

Power Integrity (PI) analysis

RF/Microwave Design

Problem solving

Team collaboration

Problem solving

Written communication

Verbal communication

Ausbildung

Bachelor's degree in Electrical Engineering

Tools

Sigrity Advanced SI II

AWR

HFSS

AWR

Momentum

HFSS

Jobbeschreibung

Responsibilities

• The primarily responsible for design of advanced semiconductor packages, including both ceramic and organic substrates, including layout, parasitic extraction, and optimization
• Work with IC design, system design, package Signal Integrity (SI)/Power Integrity (PI) & thermal engineering teams to design custom interposer and substrates
• Work with SoC design teams to optimize die floorplan, bump patterns and interposer / substrate stack up
• Work with IC design team to define IC package requirements
• Design package layout using standard CAD tools
• Extract package parasitics and conduct PI/SI analysis
• Documentation and release in appropriate archival system

Preferred Knowledge, Skills, And Abilities

Layout:

• Allegro Package Designer Plus (APD+) tools for designing the package and generating artwork for fabrication.

Analysis:

• Sigrity Advanced SI II: Analysis tools for Signal integrity of parallel busses (DDRx) and serial links (PCIe Gen x), including Package and PCB effects
• Sigrity Advanced PI II: Power Integrity tools (IR drop, Impedance Profile, capacitor optimization) including Package and PCB effects

RF / Microwave Design

• AWR, Momentum and HFSS Software Circuit, system, and EM simulation for RF/microwave product development

Qualifications

• Bachelors degree in Electrical Engineering, Mechanical Engineering, or other semiconductor packaging related discipline.
• 8 to 10 years of experience in semiconductor packaging design, modeling, and simulations
• Strong authority on Cadence Allegro Package Designer Plus (APD+)
• Experience on interposer and substrate layouts and design in advanced package technologies
• Experience with 2.5D, 3D package design
• Experience with design teams on floor plan, bump and layout optimization
• Excellent skills in problem solving, written and verbal communication, excellent organization skills, and highly self-motivated
• Record of success in cross-functional team environment
• Good experience with SI/PI tools for package level extraction/simulation

Company Values

At Micross, our Core Values of integrity, communication, teamwork, quality and execution, self-discipline and accountability are cultivated throughout all levels of the organization. Micross provides a challenging and enjoyable workplace for members and supports the needs of the community.

Benefits

Micross provides competitive benefits including medical, HSA and FSA plans, dental, vision, company paid basic Life Insurance, Employee Assistance Program (EAP), 401k with employer match, paid leave, vacation, holidays, generous tuition assistance, 529 College Savings, Pet insurance, Legal insurance, and a range of well-being programs available.

Equal Opportunity Employer This employer is required to notify all applicants of their rights pursuant to federal employment laws. For further information, please review the Know Your Rights notice from the Department of Labor.