Staff Module Design Engineer

Qorvo, Inc.; Richardson (TX); On-site; USD 120,000 - 160,000; Full time

Job summary

Qorvo, Inc. seeks a Staff Electrical Module/Packaging Design Engineer to lead RF/mm-wave module development. You will integrate GaN/GaAs/Silicon MMICs into advanced packaging and mentor teammates on design ideas within a cross-functional team.

Responsibilities include DVT, test lab optimization, and supporting lifecycle stages from concept to production. Strong 3D EM skills and RF fundamentals are essential for success.

Qualifications

• BS Electrical Engineering with 8+ years of experience or MS with 5+ years or PhD with 3+ years in RF/microwave.
• Experience integrating microwave/millimeter-wave MMIC dies into FEMs and packages.
• Proficiency with 3D EM simulation tools (HFSS/Analyst) and circuit simulators (ADS, MWO, Cadence Spectre).
• Strong understanding of RF fundamentals, s-parameters, impedance matching, and passive structures.

Responsibilities

• Develop RF/mm-wave MMIC module/packaged product designs.
• Integrate MMICs into air cavity or over-mold FEMs for innovative solutions.
• Utilize 2.5D/3D EM simulators for advanced packaging.
• Conduct product checkout, optimization, and DVT testing in the lab.
• Present results to internal/external customers.
• Support lifecycle stages from concept to production.

Skills

Communication skills

RF fundamentals

Customer-focused

Education

BS Electrical Engineering

MS Electrical Engineering

PhD Electrical Engineering (RF/Microwave)

Tools

HFSS

Analyst

ADS

Microwave Office (MWO)

Cadence Spectre

Job description

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Experience Level: Professional

Job Type: Regular

Location: Richardson, TX, US, 75081

Qorvo (Nasdaq: QRVO) supplies innovative semiconductor solutions that make a better world possible. We combine product and technology leadership, systems-level expertise and global manufacturing scale to quickly solve our customers' most complex technical challenges. Qorvo serves multiple high-growth segments of large global markets, including consumer electronics, smart home/IoT, automotive, EVs, battery-powered appliances, network infrastructure, healthcare and aerospace/defense. Visit www.qorvo.com to learn how our innovative team is helping connect, protect and power our planet.

We are looking for a Staff Electrical Module/Packaging Design Engineer responsible for the development of innovative, cutting-edge RF/Microwave module/packaged products. This will involve design and development of single or multi-chip modules that would integrate GaN, GaAs or Silicon based MMICs in various type of advanced state-of-the-art packaging technologies. Additionally, depending on experience level, a portion of your time could be involved in mentoring other team members in contributing new and innovative design ideas. You will be a key member of an integrated product development team that includes marketing, program management, mechanical engineering, product engineering, package engineering, test engineering, applications engineering, manufacturing, operations, quality and reliability, and senior management.

RESPONSIBILITIES

• Individual Contributor for RF/mm-wave single or multi-chip module (MCM) based product development.
• Integrate MMIC(s) into air cavity or over molded modules towards innovative product solutions.
• Advanced package design using 2.5D and 3D electromagnetic simulators.
• Product checkout, optimization, and design verification testing (DVT) in the test lab.
• Execute DVT analysis and present results to the internal and/or external customer.
• Support product through critical lifecycle stages including concept/feasibility, development, qualification, and production.

REQUIRED TECHNICAL QUALIFICATIONS AND EXPERIENCE

• Experience in integrating microwave/millimeter-wave MMIC dies such as amplifiers, switches, phase shifters, attenuators, etc. in single or multichip air-cavity or over-mold transmit/receive front-end modules (FEMs).
• Expert-level user in 3D EM simulation tools such as HFSS and/or Analyst and knowledge of one or more of the following: ADS, Microwave Office (MWO) or Cadence (Spectre) circuit simulators.
• Expert in analyzing performance tradeoffs of FEMs using various package types such as AC/OVM QFN, laminates, FCBGA, LGA, etc.
• Strong understanding of electromagnetic theory and RF fundamentals such as s-parameters, impedance matching, transmission lines, design of passive structures such as couplers, etc.
• Hands on experience in microwave measurements, characterization, and calibration methods.
• Knowledge of advanced semiconductor technologies such as GaN, GaAs and/or Silicon.
• Broad knowledge of semiconductor RF / power packaging, materials and assembly processes supporting infrastructure and defense electronic assemblies and sub-assemblies.
• Strong written and oral communication skills with the ability to concisely summarize highly technical concepts.

DESIRED EXPERIENCE

• Knowledge of RF signal chain and system analysis is a plus.
• Knowledge of antenna design is a plus.
• Published author in technical journals and/or magazines.
• Strong ability to meet customer technical needs and schedules.

REQUIRED EDUCATION AND EXPERIENCE

• BS Electrical Engineering with 8 or more years of experience
• MS Electrical Engineering with 5 or more years of experience
• PhD Electrical Engineering (with RF/Microwave focus) with 3+ years of relevant experience

This position is not eligible for visa sponsorship by the Company.

This position requires work on US Government contracts. Applicants must be a US Person (US citizen, permanent resident, asylee or refugee).

MAKE A DIFFERENCE AT QORVO

We are Qorvo. We do more than create innovative RF and Power solutions for the mobile, defense and infrastructure markets – we are a place to innovate and shape the future of wireless communications. It starts with our employees. As a unified global team, we bring a commitment to excellence, growth and a passion for creating what's next. Explore the possibilities with us.

We are an Equal Employment Opportunity (EEO) employer and welcome all qualified applicants. Applicants will receive fair and impartial consideration without regard to any characteristics protected by applicable law, including race, color, religion, sex (as defined by law), national origin, age, military or veteran status, genetic information, or disability.