Early-Career SiP Process Engineer, Santa Rosa

Anite; Santa Rosa (CA); On-site; USD 77,000 - 191,000; Full time

Benefits offered by this job

Medical, dental and vision

Health Savings Account

Flexible Time Off

Paid Holidays

Tuition Reimbursement

Adoption Assistance

Job summary

Keysight’s High Frequency Technology Center in Santa Rosa, CA, seeks a Process Engineer in Advanced Packaging to drive next‑gen SiP module development and related process improvements. You will focus on process control, CPI, and high yields while collaborating with design, process, and manufacturing teams.

The role demands hands‑on experience in microelectronics assembly, die attach, SMT, and a strong data‑driven mindset; local relocation is required.

Qualifications

• MS or PhD in Materials Science, Physics, Chemistry, Mechanical Engineering, Manufacturing Engineering, Mechatronics, or relevant fields coupled with applicable experience in semiconductor fabrication processes.
• BS graduates with relevant experimental research experience will also be considered.
• Qualified candidates must be a recent graduate in 2026 or degree completed by June 2027.
• Candidates must be local or willing to relocate to Santa Rosa, CA.

Responsibilities

• Drive process control and stability through SPC, root cause analysis, and corrective actions using statistical tools (e.g., JMP).
• Work closely with process, integration, product, and SiP design engineers to define process and performance targets.
• Define process flows, develop new processes and drive CPI efforts to maximize product yield.
• Develop and maintain high yields; report process metrics, root cause investigations, and process change implementations at the department level.
• Ensure successful process hand off to manufacturing partners.
• Work with Operations to implement robust process control and support production processes; diagnose and resolve process problems with urgency.
• Champion and lead capital equipment acquisition projects including tool evaluation, characterization, process development, and qualification.
• Propose DOE plans, conducting experiments, and implementing process changes in a controlled fashion.
• Collaborate with equipment engineering on tool performance optimization, preventive maintenance strategies, throughput enhancements.
• Lead technical development of new SiP introductions in collaboration with upstream design teams, process and manufacturing teams, and downstream customer teams.
• Meet accelerated project schedules; communicate and manage risks.
• Develop and maintain high yields while adhering to project schedules.

Skills

SPC

Root cause analysis

JMP

DOE planning

Data analysis

Cross-functional collaboration

Education

MS or PhD in Materials Science/Physics/Chemistry/Mechanical/Manufacturing/Mechatronics

BS with relevant research experience

Tools

JMP

Job description

Keysight’s High Frequency Technology Center in Santa Rosa, CA, seeks a Process Engineer in Advanced Packaging to drive next‑gen SiP module development and related process improvements. You will focus on process control, CPI, and high yields while collaborating with design, process, and manufacturing teams.

The role demands hands‑on experience in microelectronics assembly, die attach, SMT, and a strong data‑driven mindset; local relocation is required.