Early-Career IC Package Layout Engineer

micron

Boise (ID)

On-site

USD 65,000 - 90,000

Full time

10 days ago
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Job summary

Micron Technology in Boise, Idaho, is seeking an early-career IC Package Layout Engineer to grow technical skills while contributing to advanced semiconductor packages used in memory products.

You will work with design verification, manufacturing processes, and cross-functional teams on layout, libraries, DRC checks, and automation initiatives, including AI-enabled tooling to improve productivity.

Qualifications

  • Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or related field.
  • Graduation within the last 12 months or expected graduation prior to start date.
  • Strong analytical and problem-solving skills.
  • Strong verbal and written communication skills.
  • Ability to work effectively in a collaborative, cross-functional environment.

Responsibilities

  • Develop IC package layouts for DDR, LPDDR, GDDR, NAND, and ASIC.
  • Support feasibility studies, mechanical substrate layouts, and package design activities.
  • Create and maintain PCB and IC Package Libraries (footprint creation) and execute package layout processes.
  • Participate in layout reviews with cross-functional teams and generate layout docs/drawings.
  • Perform DRC checks and use validation tools to ensure quality and manufacturability.
  • Collaborate with Package Design, SI, Product Eng, Assembly, and CAD teams to deliver solutions.
  • Support continuous improvement and design automation initiatives.
  • Utilize AI-enabled tools and data-driven workflows to improve productivity and design quality.

Skills

Strong analytical skills
Strong communication skills
Collaborative mindset
Team-oriented
Problem-solving
Python scripting

Education

Bachelor's or Master's in Electrical/Computer/Mechanical Eng

Tools

CAD/EDA tools

Job description

Micron Technology in Boise, Idaho, is seeking an early-career IC Package Layout Engineer to grow technical skills while contributing to advanced semiconductor packages used in memory products.

You will work with design verification, manufacturing processes, and cross-functional teams on layout, libraries, DRC checks, and automation initiatives, including AI-enabled tooling to improve productivity.

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