IC Package Layout Engineer – New Grad

Micron Technology, Inc.; Boise (ID); On-site; USD 90,000 - 110,000; Full time

Job summary

Micron Technology, Inc. is seeking a new college graduate IC Package Layout Engineer in Boise, ID. You will contribute to the layout design of memory and storage packages, participate in design verification, and support manufacturing processes in a collaborative, fast-paced environment.

You will gain hands-on experience with package layout, verification, and tooling while working with experienced engineers to deliver high-quality solutions for Micron’s advanced products.

Qualifications

• Bachelor's or Master's in engineering within last 12 months or soon to graduate.
• Strong analytical and problem-solving skills required.
• Good verbal and written communication; collaborative mindset.

Responsibilities

• Develop IC package layouts for DDR, LPDDR, GDDR, NAND, and ASIC.
• Support feasibility studies and mechanical substrate layouts.
• Create and maintain PCB and IC Package libraries and footprints.
• Collaborate with Design, SI/PI, Product Engineering and CAD teams.

Skills

Analytical thinking

Team collaboration

Communication

Python scripting

Education

Bachelor's degree in Electrical/Computer/Mechanical Engineering

Tools

CAD/EDA tools

Job description

Micron Technology, Inc. is seeking a new college graduate IC Package Layout Engineer in Boise, ID. You will contribute to the layout design of memory and storage packages, participate in design verification, and support manufacturing processes in a collaborative, fast-paced environment.

You will gain hands-on experience with package layout, verification, and tooling while working with experienced engineers to deliver high-quality solutions for Micron’s advanced products.