DRAM Process Integration Engineer: Lead Yield & Innovation

Micron Technology; Boise (ID); On-site; USD 120,000 - 180,000; Full time

Job summary

Micron Technology in Boise, ID, seeks a Process Integration Engineer to drive DRAM performance and manufacturability, collaborating with device physics and multiple teams. You will focus on integration and circuit issues to enable next-generation memory.

You will lead experiments in the R&D fab, optimize flows, and analyze data to fix yield, margin, and cost issues while supporting cross-functional programs and continuous improvement.

Qualifications

• MS in engineering with 7–10+ years of semiconductor industry experience.
• Expertise in DRAM and NAND memory technologies.
• Strong knowledge of semiconductor device physics and process integration.

Responsibilities

• Lead technology integration activities enabling manufacturability of DRAM technology.
• Collaborate with cross-functional teams (process development, product engineering, design) to address yield and margin issues.
• Design and run experiments in the R&D fab.
• Optimize process flows and develop solutions to meet product requirements.
• Extract, analyze, and act on inline/defect/param/probe data to fix yield, performance, and cost issues.

Skills

DRAM memory technology

Semiconductor device physics

Process integration

Data analysis & DOE

Project management

Cross-functional collaboration

Education

MS in engineering

PhD in engineering

Job description

Micron Technology in Boise, ID, seeks a Process Integration Engineer to drive DRAM performance and manufacturability, collaborating with device physics and multiple teams. You will focus on integration and circuit issues to enable next-generation memory.

You will lead experiments in the R&D fab, optimize flows, and analyze data to fix yield, margin, and cost issues while supporting cross-functional programs and continuous improvement.